Ganitzer; Paul

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ganitzer; Paul.The latest application filed is for "composite wafer, semiconductor device and electronic component".

Company Profile

11.23.30

Ganitzer; Paul - Finkenstein AT
Ganitzer; Paul - Villach AT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Composite Wafer, Semiconductor Device and Electronic Component App 20220181211 - Ganitzer; Paul ; et al.	2022-06-09
Composite wafer, semiconductor device and electronic component Grant 11,302,579 - Ganitzer , et al. April 12, 2	2022-04-12
Semiconductor Package And Methods Of Manufacturing A Semiconductor Package App 20210335739 - Feil; Thomas ; et al.	2021-10-28
Semiconductor package and methods of manufacturing a semiconductor package Grant 11,081,457 - Feil , et al. August 3, 2	2021-08-03
Semiconductor Device With Metallization Structure On Opposite Sides Of A Semiconductor Portion App 20210183763 - Ganitzer; Paul ; et al.	2021-06-17
Semiconductor device with metallization structure on opposite sides of a semiconductor portion Grant 10,971,449 - Ganitzer , et al. April 6, 2	2021-04-06
Composite Wafer, Semiconductor Device and Electronic Component App 20200273750 - Ganitzer; Paul ; et al.	2020-08-27
Composite wafer, semiconductor device, electronic component and method of manufacturing a semiconductor device Grant 10,672,664 - Ganitzer , et al.	2020-06-02
Semiconductor Device with Metallization Structure on Opposite Sides of a Semiconductor Portion App 20200126904 - Ganitzer; Paul ; et al.	2020-04-23
Semiconductor device with metallization structure on opposite sides of a semiconductor portion Grant 10,593,623 - Ganitzer , et al.	2020-03-17
Method of reducing a sheet resistance in an electronic device, and an electronic device Grant 10,573,533 - Fuergut , et al. Feb	2020-02-25
Semiconductor Package and Methods of Manufacturing a Semiconductor Package App 20190267362 - Feil; Thomas ; et al.	2019-08-29
Wafer Based Beol Process For Chip Embedding App 20190259874 - Ganitzer; Paul ; et al.	2019-08-22
Composite Wafer, Semiconductor Device, Electronic Component and Method of Manufacturing a Semiconductor Device App 20190088550 - Ganitzer; Paul ; et al.	2019-03-21
Method Of Reducing A Sheet Resistance In An Electronic Device, And An Electronic Device App 20190013210 - Fuergut; Edward ; et al.	2019-01-10
Semiconductor Device with Metallization Structure on Opposite Sides of a Semiconductor Portion App 20180138120 - Ganitzer; Paul ; et al.	2018-05-17
Methods of manufacturing a semiconductor device by forming a separation trench Grant 9,935,055 - Meiser , et al. April 3, 2	2018-04-03
Method for manufacturing semiconductor devices having a metallisation layer Grant 9,887,152 - Zelsacher , et al. February 6, 2	2018-02-06
Processing of thick metal pads Grant 9,673,157 - Ganitzer , et al. June 6, 2	2017-06-06
Methods of Manufacturing a Semiconductor Device by Forming a Separation Trench App 20170012002 - Meiser; Andreas ; et al.	2017-01-12
Method of reducing a sheet resistance in an electronic device, and an electronic device App 20160336226 - FUERGUT; Edward ; et al.	2016-11-17
Processing Of Thick Metal Pads App 20160307858 - Ganitzer; Paul ; et al.	2016-10-20
Semiconductor workpiece having a semiconductor substrate with at least two chip areas Grant 9,461,004 - Meiser , et al. October 4, 2	2016-10-04
Processing of thick metal pads Grant 9,397,055 - Ganitzer , et al. July 19, 2	2016-07-19
Processing of Thick Metal Pads App 20150348921 - Ganitzer; Paul ; et al.	2015-12-03
Semiconductor Workpiece Having a Semiconductor Substrate with at Least Two Chip Areas App 20150262942 - Meiser; Andreas ; et al.	2015-09-17
Method For Manufacturing Semiconductor Devices Having A Metallisation Layer App 20150243592 - Zelsacher; Rudolf ; et al.	2015-08-27
Wafer Based Beol Process For Chip Embedding App 20150221764 - Ganitzer; Paul ; et al.	2015-08-06
Method of manufacturing a semiconductor device and a semiconductor workpiece Grant 9,070,741 - Meiser , et al. June 30, 2	2015-06-30
Method for manufacturing semiconductor devices having a metallisation layer Grant 9,030,028 - Zelsacher , et al. May 12, 2	2015-05-12
Method for manufacturing semiconductor devices having a metallisation layer Grant 9,029,200 - Zelsacher , et al. May 12, 2	2015-05-12
Layer stack Grant 9,006,899 - Ganitzer , et al. April 14, 2	2015-04-14
Method For Manufacturing Semiconductor Devices Having A Metallisation Layer App 20140284819 - Zelsacher; Rudolf ; et al.	2014-09-25
Method of Manufacturing a Semiconductor Device and a Semiconductor Workpiece App 20140167209 - Meiser; Andreas ; et al.	2014-06-19
Method of Fabricating a Layer Stack App 20140167270 - Ganitzer; Paul ; et al.	2014-06-19
Device and method including a soldering process Grant 8,710,678 - Ganitzer , et al. April 29, 2	2014-04-29
Method for manufacturing a semiconductor package Grant 8,603,858 - Standing , et al. December 10, 2	2013-12-10
Method For Manufacturing A Semiconductor Package App 20130017651 - Standing; Martin ; et al.	2013-01-17
Semiconductor chip, semiconductor device and methods for producing the same Grant 8,324,115 - Otremba , et al. December 4, 2	2012-12-04
Device And Method Including A Soldering Process App 20120267770 - Ganitzer; Paul ; et al.	2012-10-25
Device and method including a soldering process Grant 8,211,752 - Ganitzer , et al. July 3, 2	2012-07-03
Method For Manufacturing Semiconductor Devices Having A Metallisation Layer App 20120013029 - Zelsacher; Rudolf ; et al.	2012-01-19
Method for Producing a Connection Electrode for Two Semiconductor Zones Arranged One Above Another App 20110294289 - Reiger; Walter ; et al.	2011-12-01
Method for producing a connection electrode for two semiconductor zones arranged one above another Grant 7,851,349 - Rieger , et al. December 14, 2	2010-12-14
Device And Method Including A Soldering Process App 20090134501 - Ganitzer; Paul ; et al.	2009-05-28
Semiconductor chip, semiconductor device and methods for producing the same App 20080105907 - Otremba; Ralf ; et al.	2008-05-08
Method For Producing An Integrated Circuit Including A Connection Contact On A Semiconductor Body App 20080096382 - GANITZER; Paul ; et al.	2008-04-24
Method for producing a connection electrode for two semiconductor zones arranged one above another App 20070093019 - Rieger; Walter ; et al.	2007-04-26
Silicon wafer with solderable coating on its wafer rear side, and process for producing it App 20060273810 - Ganitzer; Paul ; et al.	2006-12-07

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.