Gandhi; Saumya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gandhi; Saumya.The latest application filed is for "packaged multichip module with conductive connectors".

Company Profile

7.6.7

Gandhi; Saumya - Irving TX
- Irving TX US
Gandhi; Saumya - Lewisville TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Packaged semiconductor system having unidirectional connections to discrete components Grant 10,756,013 - Gandhi , et al. A	2020-08-25
Packaged Multichip Module With Conductive Connectors App 20200243428 - Gurrum; Siva Prakash ; et al.	2020-07-30
Packaged Semiconductor System Having Unidirectional Connections To Discrete Components App 20200185323 - Gandhi; Saumya ; et al.	2020-06-11
Packaged multichip module with conductive connectors Grant 10,622,290 - Gurrum , et al.	2020-04-14
Packaged semiconductor system having unidirectional connections to discrete components Grant 10,566,276 - Gandhi , et al. Feb	2020-02-18
Method For Improving Transistor Performance App 20200035833A1 -	2020-01-30
Packaged Multichip Module With Conductive Connectors App 20200020620 - Gurrum; Siva Prakash ; et al.	2020-01-16
Method for improving transistor performance Grant 10,431,684 - Kummerl , et al. O	2019-10-01
Packaged Semiconductor System Having Unidirectional Connections To Discrete Components App 20190139883 - Gandhi; Saumya ; et al.	2019-05-09
Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips Grant 9,852,979 - Romig , et al. December 26, 2	2017-12-26
Method For Improving Transistor Performance App 20170309748 - Kummerl; Steven ; et al.	2017-10-26
Conductive Through-Polymer Vias for Capacitative Structures Integrated with Packaged Semiconductor Chips App 20170047283 - Romig; Matthew D. ; et al.	2017-02-16
Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips Grant 9,572,261 - Romig , et al. February 14, 2	2017-02-14
Conductive Through-Polymer Vias for Capacitative Structures Integrated with Packaged Semiconductor Chips App 20160286654 - Romig; Matthew D. ; et al.	2016-09-29

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