| Patent | Date |
|---|
Package integration for laterally mounted IC dies with dissimilar solder interconnects
Grant 11,373,989 - Gandhi , et al. June 28, 2 | 2022-06-28 |
Stacked silicon package assembly having thermal management
Grant 11,355,412 - Gandhi , et al. June 7, 2 | 2022-06-07 |
Chip package assembly with enhanced solder resist crack resistance
Grant 11,315,858 - Sun , et al. April 26, 2 | 2022-04-26 |
Modular stacked silicon package assembly
Grant 11,302,674 - Gandhi , et al. April 12, 2 | 2022-04-12 |
Chip package assembly with stress decoupled interconnect layer
Grant 11,282,775 - Gandhi , et al. March 22, 2 | 2022-03-22 |
High density routing for heterogeneous package integration
Grant 11,282,776 - Gandhi , et al. March 22, 2 | 2022-03-22 |
Chip package assembly with enhanced interconnects and method for fabricating the same
Grant 11,217,550 - Gandhi , et al. January 4, 2 | 2022-01-04 |
Stacked silicon package assembly having thermal management using phase change material
Grant 11,195,780 - Gandhi , et al. December 7, 2 | 2021-12-07 |
Modular Stacked Silicon Package Assembly
App 20210366873 - GANDHI; Jaspreet Singh ; et al. | 2021-11-25 |
Stacked silicon package assembly having thermal management
Grant 11,145,566 - Refai-Ahmed , et al. October 12, 2 | 2021-10-12 |
Test structures for validating package fabrication process
Grant 11,127,643 - Heyfitch , et al. September 21, 2 | 2021-09-21 |
Multi-die device structures and methods
Grant 11,114,360 - Gandhi , et al. September 7, 2 | 2021-09-07 |
Stacked Silicon Package Assembly Having Thermal Management
App 20210249328 - REFAI-AHMED; Gamal ; et al. | 2021-08-12 |
Stacked Silicon Package Assembly Having Vertical Thermal Management
App 20210193620 - Refai-Ahmed; Gamal ; et al. | 2021-06-24 |
Fanout Integration For Stacked Silicon Package Assembly
App 20210134757 - GANDHI; Jaspreet Singh ; et al. | 2021-05-06 |
Package integration for high bandwidth memory
Grant 10,971,474 - Gandhi , et al. April 6, 2 | 2021-04-06 |
Solder joints for board level reliability
Grant 10,930,611 - Gandhi , et al. February 23, 2 | 2021-02-23 |
High density substrate and stacked silicon package assembly having the same
Grant 10,879,157 - Gandhi December 29, 2 | 2020-12-29 |
Package Integration For Memory Devices
App 20200303341 - Kim; Myongseob ; et al. | 2020-09-24 |
Package integration for memory devices
Grant 10,770,430 - Kim , et al. Sep | 2020-09-08 |
High Density Substrate And Stacked Silicon Package Assembly Having The Same
App 20200161229 - Gandhi; Jaspreet Singh | 2020-05-21 |
Stacked Silicon Package Assembly Having Thermal Management
App 20200105642 - Gandhi; Jaspreet Singh ; et al. | 2020-04-02 |
Methods of interconnect for high density 2.5D and 3D integration
Grant 10,593,638 - Gandhi , et al. | 2020-03-17 |
Chip Package Assembly With Enhanced Interconnects And Method For Fabricating The Same
App 20200035635 - Gandhi; Jaspreet Singh ; et al. | 2020-01-30 |
Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal management
Grant 10,529,645 - Gandhi , et al. J | 2020-01-07 |
Testing system for lid-less integrated circuit packages
Grant 10,527,670 - Refai-Ahmed , et al. J | 2020-01-07 |
Chip package assembly with enhanced interconnects and method for fabricating the same
Grant 10,403,591 - Gandhi Sep | 2019-09-03 |
High Density Routing For Heterogeneous Package Integration
App 20190259695 - Gandhi; Jaspreet Singh ; et al. | 2019-08-22 |
Chip package assembly with enhanced interconnects and method for fabricating the same
Grant 10,319,606 - Gandhi , et al. | 2019-06-11 |
Chip Package Assembly With Enhanced Interconnects And Method For Fabricating The Same
App 20190131265 - Gandhi; Jaspreet Singh | 2019-05-02 |
Stacked silicon package assembly having conformal lid
Grant 10,236,229 - Gandhi | 2019-03-19 |
Methods And Apparatus For Thermal Interface Material (tim) Bond Line Thickness (blt) Reduction And Tim Adhesion Enhancement For Efficient Thermal Management
App 20180358280 - Gandhi; Jaspreet Singh ; et al. | 2018-12-13 |
Method and apparatus for assembling and testing a multi-integrated circuit package
Grant 10,096,502 - Refai-Ahmed , et al. October 9, 2 | 2018-10-09 |
Testing System For Lid-less Integrated Circuit Packages
App 20180284187 - Refai-Ahmed; Gamal ; et al. | 2018-10-04 |
Methods Of Interconnect For High Density 2.5d And 3d Integration
App 20180286826 - Gandhi; Jaspreet Singh ; et al. | 2018-10-04 |
Method And Apparatus For Assembling And Testing A Multi-integrated Circuit Package
App 20180144963 - Refai-Ahmed; Gamal ; et al. | 2018-05-24 |
Stacked Silicon Package Assembly Having Conformal Lid
App 20170372979 - Gandhi; Jaspreet Singh | 2017-12-28 |
Silane coating compositions and methods of use thereof
Grant 7,994,249 - van Ooij , et al. August 9, 2 | 2011-08-09 |
Silane coating compositions and methods of use thereof
App 20070056469 - van Ooij; William J. ; et al. | 2007-03-15 |
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