| Patent | Date |
|---|
Methods Of Manufacturing Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths
App 20220013434 - Vadhavkar; Sameer S. ; et al. | 2022-01-13 |
Bonding pads with thermal pathways
Grant 11,139,258 - Gandhi , et al. October 5, 2 | 2021-10-05 |
Method For Manufacturing A Semiconductor Device Assembly With Through-mold Cooling Channel Formed In Encapsulant
App 20210125899 - Bitz; Bradley R. ; et al. | 2021-04-29 |
Method for manufacturing a semiconductor device assembly with through-mold cooling channel formed in encapsulant
Grant 10,916,487 - Bitz , et al. February 9, 2 | 2021-02-09 |
Semiconductor devices having conductive vias and methods of forming the same
Grant 10,886,196 - Gandhi January 5, 2 | 2021-01-05 |
Thermal Pads Between Stacked Semiconductor Dies And Associated Systems And Methods
App 20200411482 - Gandhi; Jaspreet S. ; et al. | 2020-12-31 |
Interconnect structures with intermetallic palladium joints and associated systems and methods
Grant 10,861,825 - Gandhi December 8, 2 | 2020-12-08 |
Solder bond site including an opening with discontinuous profile
Grant 10,847,382 - Gandhi , et al. November 24, 2 | 2020-11-24 |
Stacked Semiconductor Die Assemblies With Multiple Thermal Paths And Associated Systems And Methods
App 20200350224 - Groothuis; Steven K. ; et al. | 2020-11-05 |
Semiconductor device assembly with heat transfer structure formed from semiconductor material
Grant 10,748,878 - Vadhavkar , et al. A | 2020-08-18 |
Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods
Grant 10,741,468 - Groothuis , et al. A | 2020-08-11 |
Methods for forming interconnect assemblies with probed bond pads
Grant 10,741,460 - Fay , et al. A | 2020-08-11 |
Uniform back side exposure of through-silicon vias
Grant 10,692,733 - Gandhi , et al. | 2020-06-23 |
Bonding Pads With Thermal Pathways
App 20200176404 - GANDHI; JASPREET S. ; et al. | 2020-06-04 |
Thermal pads between stacked semiconductor dies and associated systems and methods
Grant 10,651,155 - Gandhi , et al. | 2020-05-12 |
Bonding pads with thermal pathways
Grant 10,580,746 - Gandhi , et al. | 2020-03-03 |
Bonding pads with thermal pathways
Grant 10,573,612 - Gandhi , et al. Feb | 2020-02-25 |
Semiconductor device assembly with heat transfer structure formed from semiconductor material
Grant 10,559,551 - Vadhavkar , et al. Feb | 2020-02-11 |
Solder Bond Site Including An Opening With Discontinuous Profile
App 20190393050 - Gandhi; Jaspreet S. ; et al. | 2019-12-26 |
Semiconductor device test apparatuses comprising at least one test site having an array of pockets
Grant 10,481,200 - Gandhi , et al. Nov | 2019-11-19 |
Semiconductor Device Assembly With Heat Transfer Structure Formed From Semiconductor Material
App 20190348401 - Vadhavkar; Sameer S. ; et al. | 2019-11-14 |
Semiconductor Device Assembly With Through-mold Cooling Channel Formed In Encapsulant
App 20190333840 - Bitz; Bradley R. ; et al. | 2019-10-31 |
Uniform Back Side Exposure Of Through-silicon Vias
App 20190304799 - Gandhi; Jaspreet S. ; et al. | 2019-10-03 |
Method for manufacturing a semiconductor device assembly with through-mold cooling channel formed in encapsulant
Grant 10,424,531 - Bitz , et al. Sept | 2019-09-24 |
Solder bond site including an opening with discontinuous profile
Grant 10,410,882 - Gandhi , et al. Sept | 2019-09-10 |
Uniform back side exposure of through-silicon vias
Grant 10,410,879 - Gandhi , et al. Sept | 2019-09-10 |
Interconnect Structures With Intermetallic Palladium Joints And Associated Systems And Methods
App 20190237434 - Gandhi; Jaspreet S. | 2019-08-01 |
Semiconductor Device Assembly With Heat Transfer Structure Formed From Semiconductor Material
App 20190229096 - Vadhavkar; Sameer S. ; et al. | 2019-07-25 |
Semiconductor Devices Having Conductive Vias And Methods Of Forming The Same
App 20190229039 - Gandhi; Jaspreet S. | 2019-07-25 |
Semiconductor device assembly with heat transfer structure formed from semiconductor material
Grant 10,297,577 - Vadhavkar , et al. | 2019-05-21 |
Stacked Semiconductor Die Assemblies With Multiple Thermal Paths And Associated Systems And Methods
App 20190122950 - Groothuis; Steven K. ; et al. | 2019-04-25 |
Semiconductor device having through-silicon-via and methods of forming the same
Grant 10,262,922 - Gandhi , et al. | 2019-04-16 |
Interconnect structures with intermetallic palladium joints and associated systems and methods
Grant 10,256,216 - Gandhi | 2019-04-09 |
Semiconductor Device Test Apparatuses
App 20190072608 - Gandhi; Jaspreet S. ; et al. | 2019-03-07 |
Solder Bond Site Including An Opening With Discontinuous Profile
App 20190074194 - Gandhi; Jaspreet S. ; et al. | 2019-03-07 |
Interconnect structures with intermetallic palladium joints and associated systems and methods
Grant 10,224,313 - Gandhi | 2019-03-05 |
Methods For Forming Interconnect Assemblies With Probed Bond Pads
App 20190051569 - Fay; Owen R. ; et al. | 2019-02-14 |
Interconnect Structures With Intermetallic Palladium Joints And Associated Systems And Methods
App 20190013296 - Gandhi; Jaspreet S. | 2019-01-10 |
Thermal Pads Between Stacked Semiconductor Dies And Associated Systems And Methods
App 20190006323 - Gandhi; Jaspreet S. ; et al. | 2019-01-03 |
Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods
Grant 10,170,389 - Groothuis , et al. J | 2019-01-01 |
Bonding Pads With Thermal Pathways
App 20180374810 - Gandhi; Jaspreet S. ; et al. | 2018-12-27 |
Bonding pads with thermal pathways
Grant 10,163,830 - Gandhi , et al. Dec | 2018-12-25 |
Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths
Grant 10,163,755 - Vadhavkar , et al. Dec | 2018-12-25 |
Bonding Pads With Thermal Pathways
App 20180358314 - Gandhi; Jaspreet S. ; et al. | 2018-12-13 |
Methods for forming interconnect assemblies with probed bond pads
Grant 10,134,647 - Fay , et al. November 20, 2 | 2018-11-20 |
Methods of testing semiconductor devices comprising a die stack having protruding conductive elements
Grant 10,126,357 - Gandhi , et al. November 13, 2 | 2018-11-13 |
Methods Of Manufacturing Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths
App 20180308785 - Vadhavkar; Sameer S. ; et al. | 2018-10-25 |
Thermal pads between stacked semiconductor dies and associated systems and methods
Grant 10,096,579 - Gandhi , et al. October 9, 2 | 2018-10-09 |
Semiconductor Device Assembly With Through-mold Cooling Channel Formed In Encapsulant
App 20180219002 - Bitz; Bradley R. ; et al. | 2018-08-02 |
Semiconductor Device Having Through-silicon-via And Methods Of Forming The Same
App 20180190571 - Gandhi; Jaspreet S. ; et al. | 2018-07-05 |
Interconnect Structures With Intermetallic Palladium Joints And Associated Systems And Methods
App 20180190620 - Gandhi; Jaspreet S. | 2018-07-05 |
Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methods
Grant 9,966,347 - Wirz , et al. May 8, 2 | 2018-05-08 |
Semiconductor device assembly with through-mold cooling channel formed in encapsulant
Grant 9,960,150 - Bitz , et al. May 1, 2 | 2018-05-01 |
Semiconductor device having through-silicon-via and methods of forming the same
Grant 9,941,190 - Gandhi , et al. April 10, 2 | 2018-04-10 |
Interconnect structures with intermetallic palladium joints and associated systems and methods
Grant 9,905,539 - Gandhi February 27, 2 | 2018-02-27 |
Interconnect Structure With Improved Conductive Properties And Associated Systems And Methods
App 20180040592 - Gandhi; Jaspreet S. ; et al. | 2018-02-08 |
Uniform Back Side Exposure Of Through-silicon Vias
App 20180033641 - Gandhi; Jaspreet S. ; et al. | 2018-02-01 |
Semiconductor device assemblies including intermetallic compound interconnect structures
Grant 9,881,886 - Gandhi January 30, 2 | 2018-01-30 |
Semiconductor Device Assembly With Heat Transfer Structure Formed From Semiconductor Material
App 20170365584 - Vadhavkar; Sameer S. ; et al. | 2017-12-21 |
Semiconductor device assembly with through-mold cooling channel formed in encapsulant
App 20170358556 - Bitz; Bradley R. ; et al. | 2017-12-14 |
Thermal Pads Between Stacked Semiconductor Dies And Associated Systems And Methods
App 20170352645 - Gandhi; Jaspreet S. ; et al. | 2017-12-07 |
Interconnect structure with improved conductive properties and associated systems and methods
Grant 9,837,383 - Gandhi , et al. December 5, 2 | 2017-12-05 |
Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods
Grant 9,837,396 - Vadhavkar , et al. December 5, 2 | 2017-12-05 |
Methods Of Testing Semiconductor Devices
App 20170336470 - Gandhi; Jaspreet S. ; et al. | 2017-11-23 |
Uniform back side exposure of through-silicon vias
Grant 9,818,622 - Gandhi , et al. November 14, 2 | 2017-11-14 |
Under-bump Metal Structures For Interconnecting Semiconductor Dies Or Packages And Associated Systems And Methods
App 20170287857 - Wirz; Brandon P. ; et al. | 2017-10-05 |
Semiconductor device assembly with heat transfer structure formed from semiconductor material
Grant 9,768,149 - Vadhavkar , et al. September 19, 2 | 2017-09-19 |
Thermal pads between stacked semiconductor dies and associated systems and methods
Grant 9,768,147 - Gandhi , et al. September 19, 2 | 2017-09-19 |
Semiconductor devices and methods for backside photo alignment
Grant 9,741,612 - Wirz , et al. August 22, 2 | 2017-08-22 |
Semiconductor device test apparatuses
Grant 9,733,304 - Gandhi , et al. August 15, 2 | 2017-08-15 |
Methods Of Manufacturing Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths
App 20170229439 - Vadhavkar; Sameer S. ; et al. | 2017-08-10 |
Methods For Forming Interconnect Assemblies With Probed Bond Pads
App 20170207139 - Fay; Owen R. ; et al. | 2017-07-20 |
Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methods
Grant 9,704,781 - Wirz , et al. July 11, 2 | 2017-07-11 |
Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths
Grant 9,691,746 - Vadhavkar , et al. June 27, 2 | 2017-06-27 |
Interconnect Structures With Intermetallic Palladium Joints And Associated Systems And Methods
App 20170148769 - Gandhi; Jaspreet S. | 2017-05-25 |
Interconnect assemblies with probed bond pads
Grant 9,646,899 - Fay , et al. May 9, 2 | 2017-05-09 |
Semiconductor Device Assemblies Including Intermetallic Compound Interconnect Structures
App 20170062365 - Gandhi; Jaspreet S. | 2017-03-02 |
Bonding Pads With Thermal Pathways
App 20170053881 - GANDHI; JASPREET S. ; et al. | 2017-02-23 |
Interconnect structures with intermetallic palladium joints and associated systems and methods
Grant 9,564,418 - Gandhi February 7, 2 | 2017-02-07 |
Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths And Associated Methods
App 20160372452 - Vadhavkar; Sameer S. ; et al. | 2016-12-22 |
Methods of forming semiconductor device assemblies and interconnect structures, and related semiconductor device assemblies and interconnect structures
Grant 9,520,370 - Gandhi December 13, 2 | 2016-12-13 |
Bonding pads with thermal pathways
Grant 9,515,002 - Gandhi , et al. December 6, 2 | 2016-12-06 |
Semiconductor Devices And Packages Including Conductive Underfill Material And Related Methods
App 20160351530 - Gandhi; Jaspreet S. ; et al. | 2016-12-01 |
Interconnect Structure With Improved Conductive Properties And Associated Systems And Methods
App 20160343689 - Gandhi; Jaspreet S. ; et al. | 2016-11-24 |
Semiconductor Device Assembly With Heat Transfer Structure Formed From Semiconductor Material
App 20160343687 - Vadhavkar; Sameer S. ; et al. | 2016-11-24 |
Semiconductor Device Having Through-silicon-via And Methods Of Forming The Same
App 20160293519 - Gandhi; Jaspreet S. ; et al. | 2016-10-06 |
Semiconductor Devices Having Conductive Vias And Methods Of Forming The Same
App 20160284626 - Gandhi; Jaspreet S. | 2016-09-29 |
Methods and structures for processing semiconductor devices using polymeric materials and adhesives
Grant 9,449,940 - Gandhi September 20, 2 | 2016-09-20 |
Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods
Grant 9,443,744 - Vadhavkar , et al. September 13, 2 | 2016-09-13 |
Bonding Pads With Thermal Pathways
App 20160233139 - GANDHI; JASPREET S. ; et al. | 2016-08-11 |
Interconnect structure with improved conductive properties and associated systems and methods
Grant 9,412,675 - Gandhi , et al. August 9, 2 | 2016-08-09 |
Uniform Back Side Exposure Of Through-silicon Vias
App 20160225695 - Gandhi; Jaspreet S. ; et al. | 2016-08-04 |
Semiconductor Devices And Methods For Backside Photo Alignment
App 20160172242 - Wirz; Brandon P. ; et al. | 2016-06-16 |
Methods for forming semiconductor device packages with photoimageable dielectric adhesive material, and related semiconductor device packages
Grant 9,362,143 - Sun , et al. June 7, 2 | 2016-06-07 |
Stacked semiconductor die assemblies with high efficiency thermal paths and associated systems
Grant 9,337,119 - Vadhavkar , et al. May 10, 2 | 2016-05-10 |
Semiconductor structures comprising at least one through-substrate via filled with conductive materials
Grant 9,318,438 - Bossler , et al. April 19, 2 | 2016-04-19 |
Interconnect Structures With Intermetallic Palladium Joints And Associated Systems And Methods
App 20160104693 - Gandhi; Jaspreet S. | 2016-04-14 |
Semiconductor devices and methods for backside photo alignment
Grant 9,299,663 - Wirz , et al. March 29, 2 | 2016-03-29 |
Apparatus For Testing Stacked Die Assemblies, And Related Methods
App 20160084905 - Gandhi; Jaspreet S. ; et al. | 2016-03-24 |
Methods Of Manufacturing Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths
App 20160013173 - Vadhavkar; Sameer S. ; et al. | 2016-01-14 |
Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths And Associated Methods
App 20160013115 - Vadhavkar; Sameer S. ; et al. | 2016-01-14 |
Stacked Semiconductor Die Assemblies With High Efficiency Thermal Paths And Associated Systems
App 20160013114 - Vadhavkar; Sameer S. ; et al. | 2016-01-14 |
Methods of forming semiconductor die assemblies
Grant 9,224,715 - Gandhi December 29, 2 | 2015-12-29 |
Stacked Semiconductor Die Assemblies With Multiple Thermal Paths And Associated Systems And Methods
App 20150348956 - Groothuis; Steven K. ; et al. | 2015-12-03 |
Methods Of Forming Semiconductor Device Assemblies And Interconnect Structures, And Related Semiconductor Device Assemblies And Interconnect Structures
App 20150340328 - Gandhi; Jaspreet S. | 2015-11-26 |
Interconnect Structure With Improved Conductive Properties And Associated Systems And Methods
App 20150333026 - Gandhi; Jaspreet S. ; et al. | 2015-11-19 |
Semiconductor Devices And Methods For Backside Photo Alignment
App 20150333014 - Wirz; Brandon P. ; et al. | 2015-11-19 |
Integrated circuit constructions having through substrate vias and methods of forming integrated circuit constructions having through substrate vias
Grant 9,123,700 - Gandhi , et al. September 1, 2 | 2015-09-01 |
Semiconductor Constructions and Methods of Planarizing Across a Plurality of Electrically Conductive Posts
App 20150228603 - Gandhi; Jaspreet S. | 2015-08-13 |
Thermal Pads Between Stacked Semiconductor Dies And Associated Systems And Methods
App 20150221612 - Gandhi; Jaspreet S. ; et al. | 2015-08-06 |
Semiconductor structures comprising at least one through-substrate via filled with conductive materials
App 20150214160 - Bossler; Mark A. ; et al. | 2015-07-30 |
Methods And Structures For Processing Semiconductor Devices
App 20150206813 - Gandhi; Jaspreet S. | 2015-07-23 |
Methods Of Forming Semiconductor Die Assemblies
App 20150162302 - Gandhi; Jaspreet S. | 2015-06-11 |
Under-bump Metal Structures For Interconnecting Semiconductor Dies Or Packages And Associated Systems And Methods
App 20150137353 - Wirz; Brandon P. ; et al. | 2015-05-21 |
Methods of selectively removing a substrate material
Grant 9,034,769 - Bossler , et al. May 19, 2 | 2015-05-19 |
Semiconductor constructions and methods of planarizing across a plurality of electrically conductive posts
Grant 9,029,257 - Gandhi May 12, 2 | 2015-05-12 |
Methods And Structures For Processing Semiconductor Devices
App 20150097301 - Gandhi; Jaspreet S. | 2015-04-09 |
Semiconductor assemblies and structures
Grant 8,970,034 - Gandhi March 3, 2 | 2015-03-03 |
Methods for processing semiconductor devices
Grant 8,962,449 - Gandhi February 24, 2 | 2015-02-24 |
Methods And Structures For Processing Semiconductor Devices
App 20150035126 - Gandhi; Jaspreet S. | 2015-02-05 |
Semiconductor structures comprising a dielectric material having a curvilinear profile
Grant 8,872,356 - Gandhi , et al. October 28, 2 | 2014-10-28 |
Semiconductor Devices And Packages Including Conductive Underfill Material And Related Methods
App 20140291834 - Gandhi; Jaspreet S. ; et al. | 2014-10-02 |
Methods Of Selectively Removing A Substrate Material And Related Semiconductor Structures
App 20140159239 - Bossler; Mark A. ; et al. | 2014-06-12 |
Solid state lighting devices having side reflectivity and associated methods of manufacture
Grant 8,729,590 - Gandhi , et al. May 20, 2 | 2014-05-20 |
Interconnect Assemblies With Probed Bond Pads
App 20140070832 - Fay; Owen R. ; et al. | 2014-03-13 |
Methods For Forming A Semiconductor Structure And Related Structures
App 20140042618 - Gandhi; Jaspreet S. ; et al. | 2014-02-13 |
Semiconductor Constructions and Methods of Forming Semiconductor Constructions
App 20130313710 - Sun; Yangyang ; et al. | 2013-11-28 |
Semiconductor Constructions and Methods of Planarizing Across a Plurality of Electrically Conductive Posts
App 20130309861 - Gandhi; Jaspreet S. | 2013-11-21 |
Semiconductor Assemblies, Structures, And Methods Of Fabrication
App 20130299965 - Gandhi; Jaspreet S. | 2013-11-14 |
Methods For Forming Semiconductor Device Packages With Photoimageable Dielectric Adhesive Material, And Related Semiconductor Device Packages
App 20130299986 - Sun; Yangyang ; et al. | 2013-11-14 |
Solid State Lighting Devices Having Side Reflectivity And Associated Methods Of Manufacture
App 20130240939 - Gandhi; Jaspreet S. ; et al. | 2013-09-19 |
Semiconductor Constructions
App 20130234319 - Gandhi; Jaspreet S. | 2013-09-12 |
Semiconductor constructions
Grant 8,519,516 - Gandhi August 27, 2 | 2013-08-27 |
Integrated Circuit Constructions Having Through Substrate Vias And Methods Of Forming Integrated Circuit Constructions Having Through Substrate Vias
App 20130175698 - Gandhi; Jaspreet S. ; et al. | 2013-07-11 |
Methods For Forming A Semiconductor Structure And Related Structures
App 20120248614 - Gandhi; Jaspreet S. ; et al. | 2012-10-04 |
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