Gan; Thai Kee

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gan; Thai Kee.The latest application filed is for "chip package, semiconductor arrangement, method of forming a chip package, and method of forming a semiconductor arrangement".

Company Profile

5.4.8

Gan; Thai Kee - Melaka MY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package including leads of different lengths Grant 11,417,538 - Gan , et al. August 16, 2	2022-08-16
Chip Package, Semiconductor Arrangement, Method Of Forming A Chip Package, And Method Of Forming A Semiconductor Arrangement App 20220173006 - Gan; Thai Kee ; et al.	2022-06-02
Package and lead frame design for enhanced creepage and clearance Grant 11,348,866 - Gan , et al. May 31, 2	2022-05-31
Three Level Interconnect Clip App 20220139811 - Kassim; Azlina ; et al.	2022-05-05
Semiconductor Packages Including A U-shaped Rail App 20220108949 - WANG; Lee Shuang ; et al.	2022-04-07
Semiconductor Package Having A Chip Carrier With A Pad Offset Feature App 20220102263 - Ng; Chee Yang ; et al.	2022-03-31
Package and Lead Frame Design for Enhanced Creepage and Clearance App 20210391246 - Gan; Thai Kee ; et al.	2021-12-16
Semiconductor Package Including Leads Of Different Lengths App 20210366728 - Gan; Thai Kee ; et al.	2021-11-25
Semiconductor package with space efficient lead and die pad design Grant 11,069,600 - Tean , et al. July 20, 2	2021-07-20
Lead frames including lead posts in different planes Grant 11,011,456 - Gan , et al. May 18, 2	2021-05-18
Lead Frames Including Lead Posts In Different Planes App 20210005541 - Gan; Thai Kee ; et al.	2021-01-07
Semiconductor Package with Space Efficient Lead and Die Pad Design App 20200373228 - Tean; Ke Yan ; et al.	2020-11-26

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