GAN; Qing

Patent Applications and Registrations

Patent applications and USPTO patent grants for GAN; Qing.The latest application filed is for "method for transferring thin film".

Company Profile

1.10.13

GAN; Qing - Shenyang CN
Gan; Qing - Fremont CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Transferring Thin Film App 20210118726 - GAN; Qing ; et al.	2021-04-22
Encapsulated MEMS device and method to form the same Grant 8,349,635 - Gan , et al. January 8, 2	2013-01-08
Methods for forming a through via Grant 7,696,064 - Gan , et al. April 13, 2	2010-04-13
Method for fabricating a wafer level package with device wafer and passive component integration Grant 7,629,201 - Gan , et al. December 8, 2	2009-12-08
Wafer level package including a device wafer integrated with a passive component Grant 7,576,426 - Gan , et al. August 18, 2	2009-08-18
Methods for Forming a Through Via App 20090098731 - Gan; Qing ; et al.	2009-04-16
Method for fabricating a wafer level package having through wafer vias for external package connectivity App 20080064142 - GAN; QING ; et al.	2008-03-13
Method for fabricating a wafer level package with device wafer and passive component integration App 20080003761 - Gan; Qing ; et al.	2008-01-03
Wafer level package including a device wafer integrated with a passive component App 20060220173 - Gan; Qing ; et al.	2006-10-05
Method for fabricating a wafer level package having through wafer vias for external package connectivity and related structure App 20060211233 - Gan; Qing ; et al.	2006-09-21
Wafer-level package with silicon gasket Grant 6,979,597 - Geefay , et al. December 27, 2	2005-12-27
Sloped via contacts Grant 6,903,012 - Geefay , et al. June 7, 2	2005-06-07
Wafer level chip scale hermetic package App 20040259325 - Gan, Qing	2004-12-23
Sloped via contacts App 20040198040 - Geefay, Frank S. ; et al.	2004-10-07
Wafer-level package with silicon gasket Grant 6,787,897 - Geefay , et al. September 7, 2	2004-09-07
Film deposition to enhance sealing yield of microcap wafer-level package with vias Grant 6,777,263 - Gan , et al. August 17, 2	2004-08-17
Die singulation using deep silicon etching Grant 6,777,267 - Ruby , et al. August 17, 2	2004-08-17
Method and apparatus for hermeticity determination and leak detection in semiconductor packaging Grant 6,763,702 - Chien , et al. July 20, 2	2004-07-20
Method And Apparatus For Hermeticity Determination And Leak Detection In Semiconductor Packaging App 20040118187 - Chien, Allen ; et al.	2004-06-24
Die singulation using deep silicon etching App 20040087059 - Ruby, Richard C. ; et al.	2004-05-06
Wafer-level package with silicon gasket App 20040029360 - Geefay, Frank S. ; et al.	2004-02-12
Wafer-level package with silicon gasket App 20030116825 - Geefay, Frank S. ; et al.	2003-06-26
Sloped via contacts App 20030119308 - Geefay, Frank S. ; et al.	2003-06-26

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