Gan; Chee Lip

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gan; Chee Lip.The latest application filed is for "ink composition, method for forming a conductive member, and conductive device".

Company Profile

4.6.7

Gan; Chee Lip - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of interconnecting nanowires, nanowire network and transparent conductive electrode Grant 11,417,441 - Lee , et al. August 16, 2	2022-08-16
Ink Composition, Method For Forming A Conductive Member, And Conductive Device App 20220154026 - LI; Zhenggang ; et al.	2022-05-19
Ink composition, method for forming a conductive member, and conductive device Grant 11,274,224 - Li , et al. March 15, 2	2022-03-15
Method Of Interconnecting Nanowires, Nanowire Network And Transparent Conductive Electrode App 20200273595 - Lee; Byung Hoon ; et al.	2020-08-27
Shape memory ceramic particles and structures formed thereof Grant 10,696,599 - Du , et al. June 30, 2	2020-06-30
Method of interconnecting nanowires and transparent conductive electrode Grant 10,692,621 - Lee , et al.	2020-06-23
Ink Composition, Method For Forming A Conductive Member, And Conductive Device App 20190225827 - LI; Zhenggang ; et al.	2019-07-25
Conductive paste, method for forming an interconnection and electrical device Grant 10,202,512 - Lee , et al. Feb	2019-02-12
Shape Memory Ceramic Particles and Structures Formed Thereof App 20190039959 - Du; Zehui ; et al.	2019-02-07
Conductive Paste, Method For Forming An Interconnection And Electrical Device App 20180237644 - Lee; Byung Hoon ; et al.	2018-08-23
Conductive paste, method for forming an interconnection and electrical device Grant 9,976,042 - Lee , et al. May 22, 2	2018-05-22
Method Of Interconnecting Nanowires, Nanowire Network And Transparent Condutive Electrode App 20180033516 - Lee; Byung Hoon ; et al.	2018-02-01
Conductive Paste, Method For Forming An Interconnection And Electrical Device App 20180002540 - Lee; Byung Hoon ; et al.	2018-01-04

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