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Patent applications and USPTO patent grants for Galpin; Andrew.The latest application filed is for "cmp pad conditioning assembly".
Patent | Date |
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CMP pad conditioning assembly Grant 10,471,567 - Doering , et al. Nov | 2019-11-12 |
Chemical mechanical planarization pad conditioner with elongated cutting edges Grant 10,293,463 - Galpin , et al. | 2019-05-21 |
Cmp Pad Conditioning Assembly App 20180071891 - Doering; Patrick ;   et al. | 2018-03-15 |
Chemical mechanical planarization pad conditioner Grant 9,616,547 - Smith , et al. April 11, 2 | 2017-04-11 |
Chemical Mechanical Planarization Pad Conditioner With Elongated Cutting Edges App 20170095903 - GALPIN; Andrew ;   et al. | 2017-04-06 |
Chemical Mechanical Planarization Pad Conditioner App 20160074993 - SMITH; Joseph ;   et al. | 2016-03-17 |
Chemical mechanical planarization conditioner Grant 9,132,526 - Smith , et al. September 15, 2 | 2015-09-15 |
Cmp Conditioner Pads With Superabrasive Grit Enhancement App 20150087212 - Doering; Patrick ;   et al. | 2015-03-26 |
Chemical Mechanical Planarization Conditioner App 20140113532 - Smith; Joseph ;   et al. | 2014-04-24 |
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