Patent | Date |
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Plated terminations and method of forming using electrolytic plating Grant 7,576,968 - Ritter , et al. August 18, 2 | 2009-08-18 |
System and method of plating ball grid array and isolation features for electronic components Grant 7,463,474 - Ritter , et al. December 9, 2 | 2008-12-09 |
System and method of plating ball grid array and isolation features for electronic components App 20070133147 - Ritter; Andrew P. ;   et al. | 2007-06-14 |
Plated terminations and method of forming using electrolytic plating App 20070014075 - Ritter; Andrew P. ;   et al. | 2007-01-18 |
Electronic package with filled blinds vias Grant 7,084,509 - Egitto , et al. August 1, 2 | 2006-08-01 |
Copper plated invar with acid preclean Grant 6,935,018 - Galasco , et al. August 30, 2 | 2005-08-30 |
Method of forming filled blind vias Grant 6,924,224 - Egitto , et al. August 2, 2 | 2005-08-02 |
Colloidal seed formation for printed circuit board metallization App 20050042383 - Galasco, Raymond T. ;   et al. | 2005-02-24 |
Colloidal seed formulation for printed circuit board metallization Grant 6,852,152 - Galasco , et al. February 8, 2 | 2005-02-08 |
Electronic package with filled blind vias App 20040132279 - Egitto, Frank D. ;   et al. | 2004-07-08 |
Electronic package with filled blinds vias App 20040065960 - Egitto, Frank D. ;   et al. | 2004-04-08 |
Colloidal seed formation for printed circuit board metallization App 20040058071 - Galasco, Raymond T. ;   et al. | 2004-03-25 |
Arrangement and method for degassing small-high aspect ratio drilled holes prior to wet chemical processing Grant 6,626,196 - Downes, Jr. , et al. September 30, 2 | 2003-09-30 |
Thin film attachment to laminate using a dendritic interconnection Grant 6,600,224 - Farquhar , et al. July 29, 2 | 2003-07-29 |
Copper plated invar with acid preclean App 20030102224 - Galasco, Raymond T. ;   et al. | 2003-06-05 |
Fabrication of a metalized blind via App 20030054635 - Egitto, Frank D. ;   et al. | 2003-03-20 |
Arrangement and method for degassing small-high aspect ratio drilled holes prior to wet chemical processing App 20020189637 - Downes, Francis J. JR. ;   et al. | 2002-12-19 |
Method of solder bonding processor package Grant 5,432,998 - Galasco , et al. July 18, 1 | 1995-07-18 |
Selective electroetch of copper and other metals Grant 5,374,338 - Boyko , et al. December 20, 1 | 1994-12-20 |
Copper plating bath having increased plating rate, and method Grant 4,540,473 - Bindra , et al. September 10, 1 | 1985-09-10 |
Method for determination of concentration of organic additive in plating bath Grant 4,479,852 - Bindra , et al. October 30, 1 | 1984-10-30 |