Galasco; Raymond T.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Galasco; Raymond T..The latest application filed is for "system and method of plating ball grid array and isolation features for electronic components".

Company Profile

0.12.9

Galasco; Raymond T. - Myrtle Beach SC
Galasco; Raymond T. - Vestal NY
Galasco, Raymond T. - Binghamton NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Plated terminations and method of forming using electrolytic plating Grant 7,576,968 - Ritter , et al. August 18, 2	2009-08-18
System and method of plating ball grid array and isolation features for electronic components Grant 7,463,474 - Ritter , et al. December 9, 2	2008-12-09
System and method of plating ball grid array and isolation features for electronic components App 20070133147 - Ritter; Andrew P. ; et al.	2007-06-14
Plated terminations and method of forming using electrolytic plating App 20070014075 - Ritter; Andrew P. ; et al.	2007-01-18
Electronic package with filled blinds vias Grant 7,084,509 - Egitto , et al. August 1, 2	2006-08-01
Copper plated invar with acid preclean Grant 6,935,018 - Galasco , et al. August 30, 2	2005-08-30
Method of forming filled blind vias Grant 6,924,224 - Egitto , et al. August 2, 2	2005-08-02
Colloidal seed formation for printed circuit board metallization App 20050042383 - Galasco, Raymond T. ; et al.	2005-02-24
Colloidal seed formulation for printed circuit board metallization Grant 6,852,152 - Galasco , et al. February 8, 2	2005-02-08
Electronic package with filled blind vias App 20040132279 - Egitto, Frank D. ; et al.	2004-07-08
Electronic package with filled blinds vias App 20040065960 - Egitto, Frank D. ; et al.	2004-04-08
Colloidal seed formation for printed circuit board metallization App 20040058071 - Galasco, Raymond T. ; et al.	2004-03-25
Arrangement and method for degassing small-high aspect ratio drilled holes prior to wet chemical processing Grant 6,626,196 - Downes, Jr. , et al. September 30, 2	2003-09-30
Thin film attachment to laminate using a dendritic interconnection Grant 6,600,224 - Farquhar , et al. July 29, 2	2003-07-29
Copper plated invar with acid preclean App 20030102224 - Galasco, Raymond T. ; et al.	2003-06-05
Fabrication of a metalized blind via App 20030054635 - Egitto, Frank D. ; et al.	2003-03-20
Arrangement and method for degassing small-high aspect ratio drilled holes prior to wet chemical processing App 20020189637 - Downes, Francis J. JR. ; et al.	2002-12-19
Method of solder bonding processor package Grant 5,432,998 - Galasco , et al. July 18, 1	1995-07-18
Selective electroetch of copper and other metals Grant 5,374,338 - Boyko , et al. December 20, 1	1994-12-20
Copper plating bath having increased plating rate, and method Grant 4,540,473 - Bindra , et al. September 10, 1	1985-09-10
Method for determination of concentration of organic additive in plating bath Grant 4,479,852 - Bindra , et al. October 30, 1	1984-10-30

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