Gai; Yung-Feng
Patent Applications and Registrations
Patent applications and USPTO patent grants for Gai; Yung-Feng.The latest application filed is for "leadless semiconductor package".
- Gai; Yung-Feng - Kaohsiung TW
- Gai, Yung Feng - Kaohsiung City TW
| Patent | Date |
|---|---|
| Leadless semiconductor package Grant 7,446,397 - Gai November 4, 2 | 2008-11-04 |
| Method for fabricating quad flat non-leaded package Grant 7,351,612 - Gai April 1, 2 | 2008-04-01 |
| Leadless semiconductor package App 20060278961 - Gai; Yung Feng | 2006-12-14 |
| Leadless semiconductor package Grant 7,145,222 - Gai December 5, 2 | 2006-12-05 |
| Method for fabricating quad flat non-leaded package App 20060084203 - Gai; Yung-Feng | 2006-04-20 |
| Leadless semiconductor package App 20050046008 - Gai, Yung Feng | 2005-03-03 |
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