Gaddamraja; Seshasayee
Patent Applications and Registrations
Patent applications and USPTO patent grants for Gaddamraja; Seshasayee.The latest application filed is for "chip positioning in multi-chip package".
- Gaddamraja; Seshasayee - Santa Clara CA
| Patent | Date |
|---|---|
| Hermetic solution for thermal and optical sensor-in-package Grant 9,564,569 - Wang , et al. February 7, 2 | 2017-02-07 |
| Method of chip positioning for multi-chip packaging Grant 9,196,608 - Foong , et al. November 24, 2 | 2015-11-24 |
| Stacked LED for optical sensor devices Grant 9,136,258 - Wang , et al. September 15, 2 | 2015-09-15 |
| Chip positioning in multi-chip package Grant 8,901,756 - Foong , et al. December 2, 2 | 2014-12-02 |
| Chip Positioning in Multi-Chip Package App 20140175613 - FOONG; Sally ; et al. | 2014-06-26 |
| Die Attachment, Die Stacking, And Wire Embedding Using Film App 20090001599 - Foong; Sally ; et al. | 2009-01-01 |
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