Gabler; Franz
Patent Applications and Registrations
Patent applications and USPTO patent grants for Gabler; Franz.The latest application filed is for "transducer package with integrated sealing".
- Gabler; Franz - Lappersdorf DE
| Patent | Date |
|---|---|
| Transducer package with integrated sealing Grant 10,519,030 - Elian , et al. Dec | 2019-12-31 |
| Transducer package with integrated sealing App 20170283246 - ELIAN; Klaus ; et al. | 2017-10-05 |
| Molded chip package and method of manufacturing the same Grant 9,780,061 - Gabler , et al. October 3, 2 | 2017-10-03 |
| Method of processing a substrate and a method of processing a wafer Grant 9,548,248 - Pueschner , et al. January 17, 2 | 2017-01-17 |
| Method of electrically isolating shared leads of a lead frame strip Grant 9,324,642 - Puschner , et al. April 26, 2 | 2016-04-26 |
| Method Of Processing A Substrate And A Method Of Processing A Wafer App 20160042998 - Pueschner; Frank ; et al. | 2016-02-11 |
| Molded chip package and method of manufacturing the same App 20150340307 - GABLER; Franz ; et al. | 2015-11-26 |
| Method of Electrically Isolating Shared Leads of a Lead Frame Strip App 20150130037 - Puschner; Frank ; et al. | 2015-05-14 |
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