Fuwa; Koh

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fuwa; Koh.The latest application filed is for "conductive thin film manufacturing method".

Company Profile

4.5.6

Fuwa; Koh - Chigasaki JP
FUWA; Koh - Chigasaki-shi JP
Fuwa; Koh - Kanagawa JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Conductive thin film manufacturing method Grant 10,982,323 - Maehira , et al. April 20, 2	2021-04-20
Conductive Thin Film Manufacturing Method App 20200248301 - Kind Code	2020-08-06
Device, method of manufacturing the device, and method of manufacturing array type of ultrasound probe Grant 10,568,607 - Suzuki , et al. Feb	2020-02-25
Device, Method Of Manufacturing The Device, And Method Of Manufacturing Array Type Of Ultrasound Probe App 20190290244 - SUZUKI; Taichi ; et al.	2019-09-26
Vacuum Processing Device And Vacuum Processing Method App 20140158301 - MAEHIRA; Ken ; et al.	2014-06-12
Method For The Production Of Multi-stepped Substrate App 20110089141 - Tanaka; Ai ; et al.	2011-04-21
Electrostatic chuck for an electrically insulative substrate, and a method of using same Grant 7,209,339 - Kitabayashi , et al. April 24, 2	2007-04-24
Electrostatic chuck for an electrically insulative substrate, and a method of using same App 20040218340 - Kitabayashi, Tetsuo ; et al.	2004-11-04
Chuck equipment Grant 6,781,812 - Fuwa , et al. August 24, 2	2004-08-24
Electrostatic chuck and processing apparatus for insulative substrate Grant 6,768,627 - Kitabayashi , et al. July 27, 2	2004-07-27
Chuck equipment App 20020135967 - Fuwa, Koh ; et al.	2002-09-26

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