Futonagane; Osamu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Futonagane; Osamu.The latest application filed is for "printed wiring board".
- Futonagane; Osamu - Ogaki JP
- FUTONAGANE; Osamu - Ogaki-shi JP
| Patent | Date |
|---|---|
| Printed wiring board Grant 10,095,330 - Furuta , et al. October 9, 2 | 2018-10-09 |
| Package substrate and method for manufacturing package substrate Grant 9,716,059 - Inagaki , et al. July 25, 2 | 2017-07-25 |
| Printed Wiring Board App 20160295691 - FURUTA; Toru ; et al. | 2016-10-06 |
| Package Substrate App 20160086885 - INAGAKI; Yasushi ; et al. | 2016-03-24 |
| Package Substrate And Method For Manufacturing Package Substrate App 20160064318 - INAGAKI; Yasushi ; et al. | 2016-03-03 |
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