Futatsuka; Rensei
Patent Applications and Registrations
Patent applications and USPTO patent grants for Futatsuka; Rensei.The latest application filed is for "high-strength copper based alloy free from smutting during pretreatment for plating".
- Futatsuka; Rensei - Aizuwakamatsu JP
- Futatsuka; Rensei - all of JP
| Patent | Date |
|---|---|
| High-strength copper based alloy free from smutting during pretreatment for plating Grant 5,997,810 - Futatsuka , et al. December 7, 1 | 1999-12-07 |
| Copper alloy sheet for connectors and connectors formed of same Grant 5,667,752 - Suzuki , et al. September 16, 1 | 1997-09-16 |
| Lead frame material and lead frame for semiconductor device Grant 5,510,197 - Takahashi , et al. April 23, 1 | 1996-04-23 |
| Lead frame material formed of copper alloy for resin sealed type semiconductor devices Grant 5,463,247 - Futatsuka , et al. October 31, 1 | 1995-10-31 |
| Copper alloy lead frame material for semiconductor devices Grant 4,877,577 - Futatsuka , et al. October 31, 1 | 1989-10-31 |
| Copper alloy lead material for leads of a semiconductor device Grant 4,668,471 - Futatsuka , et al. May 26, 1 | 1987-05-26 |
| Copper base alloy for leads of integrated circuit Grant 4,249,941 - Futatsuka , et al. February 10, 1 | 1981-02-10 |
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