Fusumada; Mitsuaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fusumada; Mitsuaki.The latest application filed is for "sheet for thermal bonding and sheet for thermal bonding with affixed dicing tape".

Company Profile

1.7.12

Fusumada; Mitsuaki - Ibaraki JP
Fusumada; Mitsuaki - Ibaraki-shi Osaka
Fusumada; Mitsuaki - Yuki JP
FUSUMADA; Mitsuaki - Yuki-shi Ibaraki
Fusumada; Mitsuaki - Osaka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Sheet for thermal bonding and sheet for thermal bonding with affixed dicing tape Grant 10,301,509 - Sugo , et al.	2019-05-28
Sheet For Thermal Bonding And Sheet For Thermal Bonding With Affixed Dicing Tape App 20170369744 - Sugo; Yuki ; et al.	2017-12-28
Epoxy resin composition and electronic component device Grant 9,796,828 - Ono , et al. October 24, 2	2017-10-24
Epoxy Resin Composition And Electronic Component Device App 20160177055 - ONO; Yuta ; et al.	2016-06-23
Epoxy resin composition for semiconductor encapsulation Grant 8,729,715 - Iwashige , et al. May 20, 2	2014-05-20
Epoxy Resin Composition For Electronic Parts Encapsulation And Electronic Parts-equipped Device Using The Same App 20130148304 - KITAGAWA; Yuya ; et al.	2013-06-13
Epoxy Resin Composition For Semiconductor Encapsulation And Semiconductor Device Using The Same App 20130026662 - IWASHIGE; Tomohito ; et al.	2013-01-31
Manufacturing method for semiconductor device Grant 8,298,872 - Oda , et al. October 30, 2	2012-10-30
Epoxy Resin Composition For Semiconductor Encapsulation And Semiconductor Device Obtained Using The Same App 20120153512 - SUGIMOTO; Naoya ; et al.	2012-06-21
Method Of Manufacturing Semiconductor Device App 20120115281 - Iwashige; Tomohito ; et al.	2012-05-10
Manufacturing Method For Semiconductor Device App 20110143501 - ODA; Takashi ; et al.	2011-06-16
Epoxy Resin Composition For Semiconductor Encapsulation And Semiconductor Device Using The Same App 20090281225 - ETO; Takuya ; et al.	2009-11-12
Thermosetting resin composition and semiconductor device obtained with the same Grant 6,916,538 - Noro , et al. July 12, 2	2005-07-12
Thermosetting resin composition and semiconductor device obtained with the same App 20030219619 - Noro, Hiroshi ; et al.	2003-11-27
Thermosetting resin composition and semiconductor device using the same Grant 6,617,046 - Noro , et al. September 9, 2	2003-09-09
Thermosetting resin composition and semiconductor device using the same App 20020151106 - Noro, Hiroshi ; et al.	2002-10-17

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