Furusawa; Takeshi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Furusawa; Takeshi.The latest application filed is for "stacked temperature compensated acoustic wave device with high thermal conductivity".
Company Profile
9.39.52
- Furusawa; Takeshi - Toyonaka JP
- Furusawa; Takeshi - Toyonaka-Shi JP
- Furusawa; Takeshi - Ogaki JP
- Furusawa; Takeshi - Ogaki-shi JP
- Furusawa; Takeshi - Tokyo JP
- Furusawa; Takeshi - Chiyoda-ku N/A JP
- FURUSAWA; Takeshi - Kanagawa JP
- Furusawa; Takeshi - Gifu JP
- Furusawa; Takeshi - Yokohama JP
- Furusawa; Takeshi - Hino JP
- Furusawa; Takeshi - Hachioji JP
- Furusawa; Takeshi - Fujieda JP
Patent Activity
| Patent | Date |
|---|---|
| Bulk acoustic wave components Grant 11,251,769 - Takano , et al. February 15, 2 | 2022-02-15 |
| Stacked Temperature Compensated Acoustic Wave Device With High Thermal Conductivity App 20210159877 - Fukuhara; Hironori ; et al. | 2021-05-27 |
| Method Of Making Stacked Acoustic Wave Resonator Package With Laser-drilled Vias App 20210152151 - Takano; Atsushi ; et al. | 2021-05-20 |
| Method Of Making Acoustic Wave Resonator With Laser-drilled Vias App 20210119608 - Takano; Atsushi ; et al. | 2021-04-22 |
| Acoustic Wave Resonator With Laser-drilled Vias App 20210119607 - Takano; Atsushi ; et al. | 2021-04-22 |
| Stacked Acoustic Wave Resonator Package With Laser-drilled Vias App 20210099157 - Takano; Atsushi ; et al. | 2021-04-01 |
| Bulk Acoustic Wave Components App 20200127633 - Takano; Atsushi ; et al. | 2020-04-23 |
| Methods Of Plasma Dicing Bulk Acoustic Wave Components App 20200127632 - Takano; Atsushi ; et al. | 2020-04-23 |
| Devices And Methods Related To Nested Filters App 20200077510 - DARVEAUX; Robert Francis ; et al. | 2020-03-05 |
| Printed wiring board Grant 9,980,371 - Katsuno , et al. May 22, 2 | 2018-05-22 |
| Printed wiring board and method for manufacturing printed wiring board Grant 9,917,025 - Noda , et al. March 13, 2 | 2018-03-13 |
| Printed wiring board Grant 9,793,200 - Noda , et al. October 17, 2 | 2017-10-17 |
| Printed wiring board Grant 9,723,729 - Furusawa , et al. August 1, 2 | 2017-08-01 |
| Method for manufacturing printed wiring board with conductive post and printed wiring board with conductive post Grant 9,713,267 - Furuta , et al. July 18, 2 | 2017-07-18 |
| Printed wiring board Grant 9,497,849 - Kariya , et al. November 15, 2 | 2016-11-15 |
| Printed wiring board Grant 9,474,158 - Furutani , et al. October 18, 2 | 2016-10-18 |
| Printed Wiring Board App 20160242285 - Katsuno; Takayuki ; et al. | 2016-08-18 |
| Combined substrate Grant 9,401,320 - Daizo , et al. July 26, 2 | 2016-07-26 |
| Semiconductor chip with seal ring and sacrificial corner pattern Grant 9,368,459 - Furusawa , et al. June 14, 2 | 2016-06-14 |
| Printed Wiring Board App 20160120033 - FURUSAWA; Takeshi ; et al. | 2016-04-28 |
| Printed Wiring Board App 20160113110 - FURUSAWA; Takeshi ; et al. | 2016-04-21 |
| Printed Wiring Board And Method For Manufacturing Printed Wiring Board App 20150366061 - NODA; Kota ; et al. | 2015-12-17 |
| Printed Wiring Board App 20150366062 - NODA; Kota ; et al. | 2015-12-17 |
| Method For Manufacturing Printed Wiring Board With Conductive Post And Printed Wiring Board With Conductive Post App 20150282314 - FURUTA; Toru ; et al. | 2015-10-01 |
| Combined Substrate App 20150255433 - DAIZO; Tomoya ; et al. | 2015-09-10 |
| Semiconductor Chip With Seal Ring And Sacrificial Corner Pattern App 20150108613 - FURUSAWA; Takeshi ; et al. | 2015-04-23 |
| Printed wiring board Grant 8,975,742 - Furutani , et al. March 10, 2 | 2015-03-10 |
| Semiconductor chip with seal ring and sacrificial corner pattern Grant 8,963,291 - Furusawa , et al. February 24, 2 | 2015-02-24 |
| Printed Wiring Board App 20150016079 - FURUTANI; Toshiki ; et al. | 2015-01-15 |
| Method for manufacturing printed wiring board and printed wiring board Grant 8,772,648 - Furutani , et al. July 8, 2 | 2014-07-08 |
| Printed Wiring Board App 20140014399 - KARIYA; Takashi ; et al. | 2014-01-16 |
| Semiconductor Device And A Method Of Manufacturing The Same App 20130241067 - FURUSAWA; Takeshi ; et al. | 2013-09-19 |
| Printed Wiring Board App 20130221505 - FURUTANI; Toshiki ; et al. | 2013-08-29 |
| Wiring Substrate App 20130215586 - Furusawa; Takeshi ; et al. | 2013-08-22 |
| Semiconductor device having trench-isolated element formation region Grant 8,513,808 - Hotta , et al. August 20, 2 | 2013-08-20 |
| Printed wiring board and method for manufacturing the same Grant 8,487,192 - Kunieda , et al. July 16, 2 | 2013-07-16 |
| Method for manufacturing printed wiring board Grant 8,365,402 - Furutani , et al. February 5, 2 | 2013-02-05 |
| Wiring board with built-in electronic component and method of manufacturing same Grant 8,347,493 - Taniguchi , et al. January 8, 2 | 2013-01-08 |
| Semiconductor Device And Manufacturing Method Of The Same App 20120289032 - FURUSAWA; Takeshi ; et al. | 2012-11-15 |
| Method For Manufacturing Printed Wiring Board And Printed Wiring Board App 20120199389 - FURUTANI; Toshiki ; et al. | 2012-08-09 |
| Semiconductor device having metal contacts formed in an interlayer dielectric film comprising four silicon-containing layers Grant 8,203,210 - Furusawa , et al. June 19, 2 | 2012-06-19 |
| Semiconductor device and manufacturing method of semiconductor device Grant 8,097,948 - Furusawa , et al. January 17, 2 | 2012-01-17 |
| Semiconductor Device, And Manufacturing Method Of Semiconductor Device App 20110266679 - Hotta; Katsuhiko ; et al. | 2011-11-03 |
| Semiconductor chip with seal ring and sacrificial corner pattern Grant 8,018,030 - Furusawa , et al. September 13, 2 | 2011-09-13 |
| Semiconductor Chip With Seal Ring And Sacrificial Corner Pattern App 20110215447 - Furusawa; Takeshi ; et al. | 2011-09-08 |
| Printed Wiring Board And Method For Manufacturing The Same App 20110139498 - Kunieda; Masatoshi ; et al. | 2011-06-16 |
| Semiconductor device and manufacturing method therefor Grant 7,960,279 - Furusawa , et al. June 14, 2 | 2011-06-14 |
| Semiconductor Device And Manufacturing Method Of The Same App 20110001246 - FURUSAWA; Takeshi ; et al. | 2011-01-06 |
| Semiconductor Device And Manufacturing Method Of Semiconductor Device App 20100327449 - FURUSAWA; Takeshi ; et al. | 2010-12-30 |
| Semiconductor Device App 20100314620 - FURUSAWA; Takeshi ; et al. | 2010-12-16 |
| Semiconductor device and manufacturing method of semiconductor device Grant 7,816,268 - Furusawa , et al. October 19, 2 | 2010-10-19 |
| Wiring Board And Method For Manufacturing The Same App 20100236822 - FURUTANI; Toshiki ; et al. | 2010-09-23 |
| Semiconductor Device And Manufacturing Method Of Semiconductor Device App 20100151673 - Furusawa; Takeshi ; et al. | 2010-06-17 |
| Wiring Board With Built-in Electronic Component And Method For Manufacturing The Same App 20100108371 - FURUTANI; Toshiki ; et al. | 2010-05-06 |
| Semiconductor device and manufacturing method of semiconductor device Grant 7,700,487 - Furusawa , et al. April 20, 2 | 2010-04-20 |
| Method For Manufacturing Printed Wiring Board And Printed Wiring Board App 20100078213 - FURUTANI; Toshiki ; et al. | 2010-04-01 |
| Semiconductor Device And Manufacturing Method Therefor App 20090263963 - FURUSAWA; Takeshi ; et al. | 2009-10-22 |
| Semiconductor device with seal ring Grant 7,605,448 - Furusawa , et al. October 20, 2 | 2009-10-20 |
| Semiconductor device and manufacturing method therefor Grant 7,602,063 - Furusawa , et al. October 13, 2 | 2009-10-13 |
| Wiring Board With Built-in Electronic Component And Method Of Manufacturing Same App 20090242255 - TANIGUCHI; Hirotaka ; et al. | 2009-10-01 |
| Semiconductor Device With Seal Ring App 20090189245 - FURUSAWA; Takeshi ; et al. | 2009-07-30 |
| Semiconductor Device And A Method Of Manufacturing The Same App 20090184424 - Furusawa; Takeshi ; et al. | 2009-07-23 |
| Semiconductor Device And Manufacturing Method Of The Same App 20080230847 - Furusawa; Takeshi ; et al. | 2008-09-25 |
| Network routing apparatus Grant 7,379,456 - Muranaka , et al. May 27, 2 | 2008-05-27 |
| Semiconductor Device And Manufacturing Method Of Semiconductor Device App 20070167010 - FURUSAWA; Takeshi ; et al. | 2007-07-19 |
| Semiconductor Device App 20070114668 - Goto; Kinya ; et al. | 2007-05-24 |
| Semiconductor device including sealing ring App 20060103025 - Furusawa; Takeshi ; et al. | 2006-05-18 |
| Semiconductor device App 20060055005 - Furusawa; Takeshi ; et al. | 2006-03-16 |
| Semiconductor device and manufacturing method therefor App 20060006530 - Furusawa; Takeshi ; et al. | 2006-01-12 |
| Semiconductor device having low-K insulating film Grant 6,903,445 - Ryuzaki , et al. June 7, 2 | 2005-06-07 |
| Semiconductor device and its manufacturing method App 20040256728 - Ryuzaki, Daisuke ; et al. | 2004-12-23 |
| Network routing apparatus App 20040233920 - Muranaka, Takayuki ; et al. | 2004-11-25 |
| Semiconductor manufacturing method for low-k insulating film Grant 6,777,325 - Ryuzaki , et al. August 17, 2 | 2004-08-17 |
| Method of manufacturing a semiconductor device for high speed operation and low power consumption App 20040048203 - Furusawa, Takeshi ; et al. | 2004-03-11 |
| Semiconductor device and process for producing the same Grant 6,680,541 - Furusawa , et al. January 20, 2 | 2004-01-20 |
| Semiconductor Manufacturing Method For Low-k Insulating Film App 20030201465 - Ryuzaki, Daisuke ; et al. | 2003-10-30 |
| Semiconductor device and manufacturing method thereof Grant 6,599,830 - Furusawa , et al. July 29, 2 | 2003-07-29 |
| Semiconductor device and manufacturing method thereof App 20020164865 - Furusawa, Takeshi ; et al. | 2002-11-07 |
| Semiconductor device and process for producing the same App 20020105085 - Furusawa, Takeshi ; et al. | 2002-08-08 |
| Semiconductor device and process for producing the same Grant 6,358,838 - Furusawa , et al. March 19, 2 | 2002-03-19 |
| Semiconductor device and manufacturing method thereof App 20010046783 - Furusawa, Takeshi ; et al. | 2001-11-29 |
| Semiconductor device and process for producing the same App 20010009295 - Furusawa, Takeshi ; et al. | 2001-07-26 |
| Polishing method Grant 5,609,511 - Moriyama , et al. March 11, 1 | 1997-03-11 |
| Seat belt locking device for an automobile vehicle Grant 4,310,176 - Furusawa , et al. January 12, 1 | 1982-01-12 |
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