| Patent | Date |
|---|
Metal microparticle production method and metal microparticle production device
Grant 11,318,534 - Furusawa , et al. May 3, 2 | 2022-05-03 |
Solder alloy and junction structure using same
Grant 11,135,683 - Kitaura , et al. October 5, 2 | 2021-10-05 |
Solder alloy and package structure using same
Grant 10,960,496 - Akiyama , et al. March 30, 2 | 2021-03-30 |
Bonded Structure And Bonding Material
App 20200335470 - FURUSAWA; Akio ; et al. | 2020-10-22 |
Mounting Structure And Nanoparticle Mounting Material
App 20200185347 - HINE; KIYOHIRO ; et al. | 2020-06-11 |
Metal Microparticle Production Method And Metal Microparticle Production Device
App 20200130064 - FURUSAWA; AKIO ; et al. | 2020-04-30 |
Mount structure
Grant 10,636,724 - Hine , et al. | 2020-04-28 |
Solder alloy and bonded structure using the same
Grant 10,493,567 - Sakai , et al. De | 2019-12-03 |
Jointing Material, Fabrication Method For Semiconductor Device Using The Jointing Material, And Semiconductor Device
App 20190165234 - KITAURA; Hidetoshi ; et al. | 2019-05-30 |
Solder Alloy And Junction Structure Using Same
App 20190099840 - KITAURA; HIDETOSHI ; et al. | 2019-04-04 |
Mount structure including two members that are bonded to each other with a bonding material layer having a first interface layer and a second interface layer
Grant 10,170,442 - Hine , et al. J | 2019-01-01 |
Mount Structure
App 20180331013 - HINE; KIYOHIRO ; et al. | 2018-11-15 |
Solder Alloy And Bonded Structure Using The Same
App 20180326542 - SAKAI; KAZUKI ; et al. | 2018-11-15 |
Solder Alloy And Joint Structure
App 20180257179 - KITAURA; HIDETOSHI ; et al. | 2018-09-13 |
Mounting structure and BGA ball
Grant 10,068,869 - Hine , et al. September 4, 2 | 2018-09-04 |
Mount Structure
App 20180166411 - HINE; KIYOHIRO ; et al. | 2018-06-14 |
Solder alloy and mounted structure using same
Grant 9,981,348 - Hine , et al. May 29, 2 | 2018-05-29 |
Liquid Dispersion Of Metal Nanoparticles For Solder Paste, Method For Producing The Liquid Dispersion, Solder Paste, Method For Producing The Solder Paste
App 20180056448 - HAYASHI; Yamato ; et al. | 2018-03-01 |
Solder Alloy And Package Structure Using Same
App 20170334026 - AKIYAMA; SHINNOSUKE ; et al. | 2017-11-23 |
Solder material and bonded structure
Grant 9,789,569 - Furusawa , et al. October 17, 2 | 2017-10-17 |
Solder Alloy And Package Structure Using Same
App 20170282305 - HINE; KIYOHIRO ; et al. | 2017-10-05 |
Flux For Soldering, And Soldering Paste Composition Including Same
App 20170266767 - AKIYAMA; SHINNOSUKE ; et al. | 2017-09-21 |
Solder Alloy And Mounted Structure Using Same
App 20170129057 - HINE; KIYOHIRO ; et al. | 2017-05-11 |
Mounted structure and manufacturing method of mounted structure
Grant 9,386,699 - Hine , et al. July 5, 2 | 2016-07-05 |
Mounting Structure And Bga Ball
App 20160163668 - HINE; KIYOHIRO ; et al. | 2016-06-09 |
Solder Material And Bonded Structure
App 20160039052 - FURUSAWA; AKIO ; et al. | 2016-02-11 |
Solder material and bonded structure
Grant 9,199,340 - Furusawa , et al. December 1, 2 | 2015-12-01 |
Solder Material And Bonded Structure
App 20150144388 - FURUSAWA; AKIO ; et al. | 2015-05-28 |
Semiconductor bonding structure body and manufacturing method of semiconductor bonding structure body
Grant 8,810,035 - Nakamura , et al. August 19, 2 | 2014-08-19 |
Semiconductor device
Grant 8,691,377 - Nakamura , et al. April 8, 2 | 2014-04-08 |
Soldering material and electronic component assembly
Grant 8,598,464 - Sakatani , et al. December 3, 2 | 2013-12-03 |
Mounted Structure And Manufacturing Method Of Mounted Structure
App 20130277098 - Hine; Kiyohiro ; et al. | 2013-10-24 |
Mounting structure
Grant 8,552,307 - Hine , et al. October 8, 2 | 2013-10-08 |
Semiconductor Bonding Structure Body And Manufacturing Method Of Semiconductor Bonding Structure Body
App 20130241069 - Nakamura; Taichi ; et al. | 2013-09-19 |
Joint structure and electronic component
Grant 8,421,246 - Furusawa , et al. April 16, 2 | 2013-04-16 |
Joint structure, joining material, and method for producing joining material containing bismuth
Grant 8,338,966 - Furusawa , et al. December 25, 2 | 2012-12-25 |
Bonded structure and manufacturing method for bonded structure
Grant 8,268,718 - Nakamura , et al. September 18, 2 | 2012-09-18 |
Bonding material, electronic component, bonding structure and electronic device
Grant 8,227,090 - Furusawa , et al. July 24, 2 | 2012-07-24 |
Semiconductor Component, Semiconductor Wafer Component, Manufacturing Method Of Semiconductor Component, And Manufacturing Method Of Joining Structure
App 20120153461 - Kitaura; Hidetoshi ; et al. | 2012-06-21 |
Semiconductor Device
App 20120018890 - Nakamura; Taichi ; et al. | 2012-01-26 |
Mounting Structure
App 20110284278 - Hine; Kiyohiro ; et al. | 2011-11-24 |
Bonded Structure And Manufacturing Method For Bonded Structure
App 20110175224 - NAKAMURA; Taichi ; et al. | 2011-07-21 |
Semiconductor device using lead-free solder as die bonding material and die bonding material not containing lead
Grant 7,973,412 - Fujiwara , et al. July 5, 2 | 2011-07-05 |
Soldering Material And Electronic Component Assembly
App 20110120769 - Sakatani; Shigeaki ; et al. | 2011-05-26 |
Joint Structure, Joining Material And Method For Producing Joining Material
App 20110108996 - Furusawa; Akio ; et al. | 2011-05-12 |
Solder Joint Structure, And Joining Method Of The Same
App 20110042817 - Furusawa; Akio ; et al. | 2011-02-24 |
Joint Structure And Electronic Component
App 20100301481 - Furusawa; Akio ; et al. | 2010-12-02 |
Bonding Material, Electronic Component And Bonded Structure
App 20100294550 - Furusawa; Akio ; et al. | 2010-11-25 |
Semiconductor Device And Method For Fabricating The Same
App 20100148367 - MATSUO; Takahiro ; et al. | 2010-06-17 |
Bonding Material, Electronic Component, Bonding Structure And Electronic Device
App 20090242249 - Furusawa; Akio ; et al. | 2009-10-01 |
Semiconductor Device And Die Bonding Material
App 20090166876 - Fujiwara; Seiji ; et al. | 2009-07-02 |
Method and apparatus for processing electronic parts
Grant 7,176,402 - Okumura , et al. February 13, 2 | 2007-02-13 |
Method and apparatus for processing electronic parts
App 20050179171 - Okumura, Tomohiro ; et al. | 2005-08-18 |
Solder, solder paste and soldering method
Grant 6,428,745 - Yamaguchi , et al. August 6, 2 | 2002-08-06 |
Solder, solder paste and soldering method
App 20010025875 - Yamaguchi, Atsushi ; et al. | 2001-10-04 |
Solder, solder paste and soldering method
App 20010018030 - Yamaguchi, Atsushi ; et al. | 2001-08-30 |
Solder, solder paste and soldering method
Grant 6,267,823 - Yamaguchi , et al. July 31, 2 | 2001-07-31 |
Solder, electronic component mounted by soldering, and electronic circuit board
Grant 5,962,133 - Yamaguchi , et al. October 5, 1 | 1999-10-05 |
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