FURUKAWA; Ryota

Patent Applications and Registrations

Patent applications and USPTO patent grants for FURUKAWA; Ryota.The latest application filed is for "method for producing element chips".

Company Profile

2.8.11

FURUKAWA; Ryota - OSAKA JP
FURUKAWA; Ryota - Shiojiri JP
Furukawa; Ryota - Nagano JP
FURUKAWA; Ryota - Shiojiri-shi JP
Furukawa; Ryota - Fukuoka JP
Furukawa, Ryota - Fukuoda JP
Furukawa, Ryota - Fukuoka-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Producing Element Chips App 20220199411 - TAKASAKI; Toshiyuki ; et al.	2022-06-23
Print Head, Liquid Ejecting Apparatus, And Capacitive Load Drive Integrated Circuit Apparatus App 20210300029 - FURUKAWA; Ryota	2021-09-30
Head unit control circuit Grant 10,688,784 - Furukawa	2020-06-23
Piezoelectric print head and piezoelectric ink jet printer Grant 10,457,043 - Furukawa Oc	2019-10-29
Piezoelectric Print Head And Piezoelectric Ink Jet Printer App 20190092001 - FURUKAWA; Ryota	2019-03-28
Head unit Grant 10,239,314 - Fujisawa , et al.	2019-03-26
Head Unit Control Circuit App 20190009531 - FURUKAWA; Ryota	2019-01-10
Liquid discharge apparatus, head unit, control unit, and method for controlling liquid discharge apparatus Grant 9,796,179 - Date , et al. October 24, 2	2017-10-24
Head Unit App 20170182773 - FUJISAWA; Kazuhito ; et al.	2017-06-29
Liquid Discharge Apparatus, Head Unit, Control Unit, And Method For Controlling Liquid Discharge Apparatus App 20170021615 - DATE; Kyohei ; et al.	2017-01-26
Liquid discharge head and liquid discharge device Grant 9,126,406 - Furukawa September 8, 2	2015-09-08
Liquid Discharge Head and Liquid Discharge Device App 20150231879 - Furukawa; Ryota	2015-08-20
Plasma processing method for substrates Grant 9,073,385 - Okita , et al. July 7, 2	2015-07-07
Plasma Processing Method For Substrates App 20130168353 - Okita; Shogo ; et al.	2013-07-04
Method of plasma-processing a board, chip attachment to the board and resin encapsulation of the chip Grant 6,576,500 - Furukawa , et al. June 10, 2	2003-06-10
Plasma processing apparatus and method of processing App 20020148561 - Tetsuhiro, Iwai ; et al.	2002-10-17
Plasma-processing apparatus, plasma-processing method, plasma-processed board, chip mounting method, and chip mounted assembly App 20020034840 - Furukawa, Ryota ; et al.	2002-03-21

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