Furukawa; Heizaburo
Patent Applications and Registrations
Patent applications and USPTO patent grants for Furukawa; Heizaburo.The latest application filed is for "continuous vacuum vapor deposition system having reduced pressure sub-chambers separated by seal devices".
- Furukawa; Heizaburo - Hiroshima
| Patent | Date |
|---|---|
| Continuous vacuum vapor deposition system having reduced pressure sub-chambers separated by seal devices Grant 5,000,114 - Yanagi , et al. March 19, 1 | 1991-03-19 |
| Continuous vacuum deposition apparatus with control panels for regulating width of vapor flow Grant 4,655,168 - Shimozato , et al. April 7, 1 | 1987-04-07 |
| Method of controlling deposition amount distribution in a vacuum deposition plating Grant 4,612,206 - Shimozato , et al. September 16, 1 | 1986-09-16 |
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