FURUKAWA CIRCUIT FOIL CO., LTD

Patent Applications and Registrations

Patent applications and USPTO patent grants for FURUKAWA CIRCUIT FOIL CO., LTD.The latest application filed is for "copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil".

Company Profile

0.8.14

FURUKAWA CIRCUIT FOIL CO., LTD - Tokyo JP
Furukawa Circuit Foil Co., Ltd. - Tokyo JP
Furukawa Circuit Foil Co., Ltd. - Nikko Tochigi-ken JP
FURUKAWA CIRCUIT FOIL CO., LTD. -
Furukawa Circuit Foil Co., Ltd - Nikko-city JP
Furukawa Circuit Foil Co., Ltd. - 601-2, Otorozawa Nikko-city JP
Furukawa Circuit Foil Co., Ltd - Nikkou-City JP 321-2336
FURUKAWA CIRCUIT FOIL CO., LTD. - 601-02, Otorozawa Nikkou-city JP
Furukawa Circuit Foil Co., Ltd. - Nikkou JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Copper Foil For High Frequency Circuit, Method Of Production And Apparatus For Production Of Same, And High Frequency Circuit Using Copper Foil App 20090324988 - Moteki; Takami ; et al.	2009-12-31
Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield Grant 7,476,449 - Yoshihara , et al. January 13, 2	2009-01-13
Treated copper foil and circuit board Grant 7,381,475 - Suzuki June 3, 2	2008-06-03
Surface treated electrodeposited copper foil, the production method and circuit board App 20070287020 - Saito; Takahiro ; et al.	2007-12-13
Conductive Base Material With Thin Film Resistance Layer, Method Of Production Of Conductive Base Material With Thin Film Resistance Layer, And Circuit Board With Thin Film Resistance Layer App 20070228443 - KIKUCHI; Yuuki ; et al.	2007-10-04
Ultrathin Copper Foil With Carrier And Printed Circuit Board Using Same App 20070154692 - Suzuki; Yuuji ; et al.	2007-07-05
Ultrathin copper foil with carrier and printed circuit board using same App 20070141381 - Suzuki; Yuuji ; et al.	2007-06-21
Laminated circuit board App 20070110969 - Suzuki; Yuuji ; et al.	2007-05-17
Conductive substrate with resistance layer, resistance board, and resistance circuit board Grant 7,215,235 - Matsuda , et al. May 8, 2	2007-05-08
Laminated Circuit Board App 20070048507 - SUZUKI; Yuuji ; et al.	2007-03-01
Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil App 20070042212 - Moteki; Takami ; et al.	2007-02-22
Copper foil for chip-on-film use, plasma display panel, or high-frequency printed circuit board Grant 7,172,818 - Nakaoka , et al. February 6, 2	2007-02-06
Copper foil for fine pattern printed circuits and method of production of same Grant 7,052,779 - Shinozaki May 30, 2	2006-05-30
Chip-on-film use copper foil Grant 6,939,622 - Yoshihara , et al. September 6, 2	2005-09-06
Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier App 20050158574 - Suzuki, Akitoshi ; et al.	2005-07-21
Chip-on-film use copper foil App 20040161627 - Yoshihara, Yasuhisa ; et al.	2004-08-19
Copper foil for high frequency circuit and method of production of same App 20040154930 - Shinozaki, Kensaku	2004-08-12
Copper foil for fine pattern printed circuits and method of production of same App 20040157080 - Shinozaki, Kensaku	2004-08-12
Copper foil for chip-on-film use, plasma display panel, or high-frequency printed circuit board App 20040043242 - Nakaoka, Tadao ; et al.	2004-03-04
Electrodeposited copper foil and electrodeposited copper foil for secondary battery collector App 20040029006 - Otsuka, Hideo ; et al.	2004-02-12
Insoluble electrode device for treatment of metallic material Grant 4,964,965 - Nakatsugawa October 23, 1	1990-10-23
Copper foil for a printed circuit and a method for the production thereof Grant 4,376,154 - Nakatsugawa March 8, 1	1983-03-08

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