loadpatents
name:-0.021175146102905
name:-0.018621206283569
name:-0.0062460899353027
Furuichi; Jun Patent Filings

Furuichi; Jun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Furuichi; Jun.The latest application filed is for "wiring substrate".

Company Profile
5.18.18
  • Furuichi; Jun - Nagano JP
  • Furuichi; Jun - Nagano-shi Nagano
  • Furuichi; Jun - Yokohama JP
  • Furuichi; Jun - Shizuoka N/A JP
  • Furuichi; Jun - Shizuoka-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Wiring substrate
Grant 11,011,457 - Nishimura , et al. May 18, 2
2021-05-18
Wiring substrate and semiconductor device
Grant 10,892,216 - Furuichi January 12, 2
2021-01-12
Wiring Substrate
App 20200373233 - Nishimura; Koichi ;   et al.
2020-11-26
Wiring Substrate And Semiconductor Device
App 20190333849 - Furuichi; Jun
2019-10-31
Wiring substrate and semiconductor device
Grant 10,366,949 - Shimizu , et al. July 30, 2
2019-07-30
Wiring substrate and semiconductor device
Grant 10,340,238 - Furuichi
2019-07-02
Wiring board, and semiconductor device
Grant 10,262,932 - Furuichi , et al.
2019-04-16
Wiring Substrate And Semiconductor Device
App 20190067224 - FURUICHI; Jun
2019-02-28
Clutch seal
Grant 10,100,881 - Tsukamoto , et al. October 16, 2
2018-10-16
Wiring Substrate and Semiconductor Device
App 20180166372 - SHIMIZU; Noriyoshi ;   et al.
2018-06-14
Wiring board and semiconductor device
Grant 9,997,474 - Furuichi , et al. June 12, 2
2018-06-12
Wiring substrate and semiconductor device
Grant 9,875,957 - Shimizu , et al. January 23, 2
2018-01-23
Wiring Board And Semiconductor Device
App 20170352628 - FURUICHI; Jun ;   et al.
2017-12-07
Wiring Board, And Semiconductor Device
App 20170256482 - Furuichi; Jun ;   et al.
2017-09-07
Wiring substrate and method of making wiring substrate
Grant 9,668,341 - Furuichi , et al. May 30, 2
2017-05-30
Wiring substrate and method of manufacturing the same
Grant 9,646,926 - Kunimoto , et al. May 9, 2
2017-05-09
Wiring Substrate And Method Of Making Wiring Substrate
App 20160353569 - FURUICHI; Jun ;   et al.
2016-12-01
Wiring Substrate And Method Of Manufacturing The Same
App 20160276259 - Kunimoto; Yuji ;   et al.
2016-09-22
Wiring substrate having multiple core substrates
Grant 9,386,695 - Furuichi , et al. July 5, 2
2016-07-05
Wiring Substrate and Semiconductor Device
App 20160020163 - SHIMIZU; Noriyoshi ;   et al.
2016-01-21
Wiring Substrate And Method Of Manufacturing The Same
App 20150364405 - Kunimoto; Yuji ;   et al.
2015-12-17
Clutch Seal
App 20150292572 - Tsukamoto; Koji ;   et al.
2015-10-15
Wiring substrate and manufacturing method thereof
Grant 9,159,648 - Koizumi , et al. October 13, 2
2015-10-13
Wiring substrate and method of manufacturing the same
Grant 9,078,384 - Furuichi , et al. July 7, 2
2015-07-07
Semiconductor package and manufacturing method
Grant 8,941,230 - Kyozuka , et al. January 27, 2
2015-01-27
Driving force transmission device
Grant 8,747,279 - Furuichi , et al. June 10, 2
2014-06-10
Semiconductor Package And Manufacturing Method
App 20140070396 - Kyozuka; Masahiro ;   et al.
2014-03-13
Wiring Substrate And Manufacturing Method Thereof
App 20140015121 - Koizumi; Naoyuki ;   et al.
2014-01-16
Wiring Substrate And Method Of Manufacturing Wiring Substrate
App 20130264101 - FURUICHI; Jun ;   et al.
2013-10-10
Driving Force Transmission Device
App 20130168197 - Furuichi; Jun ;   et al.
2013-07-04
Wiring Substrate And Method Of Manufacturing The Same
App 20120234589 - FURUICHI; Jun ;   et al.
2012-09-20
Automatic transmission
Grant 7,350,631 - Furuichi April 1, 2
2008-04-01
Automatic transmission
App 20060049017 - Furuichi; Jun
2006-03-09

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