Furo; Masahiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Furo; Masahiro.The latest application filed is for "method of manufacturing a metal-ceramic circuit board".

Company Profile

0.5.5

Furo; Masahiro - Tokyo JP
Furo; Masahiro - Hachioji JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of manufacturing a metal-ceramic circuit board Grant 7,487,585 - Osanai , et al. February 10, 2	2009-02-10
Metal-ceramic circuit board Grant 7,348,493 - Osanai , et al. March 25, 2	2008-03-25
Insulating substrate boards for semiconductor and power modules Grant 7,276,292 - Furo , et al. October 2, 2	2007-10-02
Method of manufacturing a metal-ceramic circuit board App 20060242826 - Osanai; Hideyo ; et al.	2006-11-02
Method of manufacturing a metal-ceramic circuit board Grant 6,938,333 - Osanai , et al. September 6, 2	2005-09-06
Method of manufacturing a metal-ceramic circuit board App 20050138799 - Osanai, Hideyo ; et al.	2005-06-30
Method of manufacturing a metal-ceramic circuit board App 20030037434 - Osanai, Hideyo ; et al.	2003-02-27
Insulating substrate boards for semiconductor and power modules App 20020164488 - Furo, Masahiro ; et al.	2002-11-07
Metal-ceramic circuit board and manufacturing method thereof App 20020050510 - Osanai, Hideyo ; et al.	2002-05-02
Method for bonding copper plate to alumina substrate and process for producing copper/alumina bonded assembly Grant 4,811,893 - Kanahara , et al. March 14, 1	1989-03-14

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