Furman; Bruce K.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Furman; Bruce K..The latest application filed is for "bonding of substrates including metal-dielectric patterns with metal raised above dielectric and structures so formed".

Company Profile

2.39.38

Furman; Bruce K. - Plattsburgh NY
Furman; Bruce K. - Poughquag NY US
- Poughquag NY US
Furman; Bruce K. - Saratoga Springs NY
Furman; Bruce K - Poughquag NY
Furman; Bruce K. - Poughguag NY
Furman; Bruce K. - Pouquag NY
Furman; Bruce K. - Beacon NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Bonding of substrates including metal-dielectric patterns with metal raised above dielectric and structures so formed Grant 8,927,087 - Chen , et al. January 6, 2	2015-01-06
Bonding Of Substrates Including Metal-dielectric Patterns With Metal Raised Above Dielectric And Structures So Formed App 20140097543 - Chen; Kuan-Neng ; et al.	2014-04-10
Bonding of substrates including metal-dielectric patterns with metal raised above dielectric and structures so formed Grant 8,617,689 - Chen , et al. December 31, 2	2013-12-31
Bonding of substrates including metal-dielectric patterns with metal raised above dielectric and structures so formed Grant 08617689 -	2013-12-31
Bonding Of Substrates Including Metal-dielectric Patterns With Metal Raised Above Dielectric And Structures So Formed App 20130307139 - Chen; Kuan-Neng ; et al.	2013-11-21
Thermo-compression bonded electrical interconnect structure and method Grant 8,541,291 - Furman , et al. September 24, 2	2013-09-24
Electrical interconnect forming method Grant 8,541,299 - Buchwalter , et al. September 24, 2	2013-09-24
Electrical interconnect structure Grant 8,476,773 - Buchwalter , et al. July 2, 2	2013-07-02
Bonding of substrates including metal-dielectric patterns with metal raised above dielectric Grant 8,241,995 - Chen , et al. August 14, 2	2012-08-14
Electrical interconnect forming method Grant 8,242,010 - Buchwalter , et al. August 14, 2	2012-08-14
Thermo-compression bonded electrical interconnect structure Grant 8,164,192 - Furman , et al. April 24, 2	2012-04-24
Patterned metal thermal interface Grant 8,156,998 - Furman , et al. April 17, 2	2012-04-17
Thermo-compression bonded electrical interconnect structure and method Grant 8,043,893 - Furman , et al. October 25, 2	2011-10-25
Thermo-compression Bonded Electrical Interconnect Structure And Method App 20110239458 - Furman; Bruce K. ; et al.	2011-10-06
Hybrid Liquid Metal-solder Thermal Interface App 20110240279 - Furman; BRUCE K. ; et al.	2011-10-06
Cooling apparatus with cold plate formed in situ on a surface to be cooled Grant 7,978,473 - Campbell , et al. July 12, 2	2011-07-12
Method and apparatus for deploying a liquid metal thermal interface for chip cooling Grant 7,952,193 - Furman , et al. May 31, 2	2011-05-31
Thermo-compression Bonded Electrical Interconnect Structure App 20110095431 - Furman; Bruce K. ; et al.	2011-04-28
Thermo-compression bonded electrical interconnect structure and method Grant 7,868,457 - Furman , et al. January 11, 2	2011-01-11
Methods for encapsulating microelectromechanical (MEM) devices on a wafer scale Grant 7,863,070 - Colgan , et al. January 4, 2	2011-01-04
Layer transfer process and functionally enhanced integrated circuits produced thereby Grant 7,855,101 - Furman , et al. December 21, 2	2010-12-21
Electronic package method and structure with cure-melt hierarchy Grant 7,834,442 - Furman , et al. November 16, 2	2010-11-16
Bonding Of Substrates Including Metal-dielectric Patterns With Metal Raised Above Dielectric App 20100255262 - Chen; Kuan-Neng ; et al.	2010-10-07
Structure for cooling a surface Grant 7,804,048 - Furman , et al. September 28, 2	2010-09-28
Electrical Interconnect Forming Method App 20100230474 - Buchwalter; Stephen Leslie ; et al.	2010-09-16
Electrical Interconnect Forming Method App 20100230475 - Buchwalter; Stephen Leslie ; et al.	2010-09-16
Electrical Interconnect Structure App 20100230143 - Buchwalter; Stephen Leslie ; et al.	2010-09-16
Electrical interconnect structure and method Grant 7,786,001 - Buchwalter , et al. August 31, 2	2010-08-31
Hermetic seal and reliable bonding structures for 3D applications Grant 7,786,596 - Chen , et al. August 31, 2	2010-08-31
Patterned Metal Thermal Interface App 20100147497 - FURMAN; BRUCE K. ; et al.	2010-06-17
Cooling Apparatus With Cold Plate Formed In Situ On A Surface To Be Cooled App 20100142150 - CAMPBELL; Levi A. ; et al.	2010-06-10
Cooling apparatus and method of fabrication thereof with a cold plate formed in situ on a surface to be cooled Grant 7,731,079 - Campbell , et al. June 8, 2	2010-06-08
Patterned metal thermal interface Grant 7,694,719 - Furman , et al. April 13, 2	2010-04-13
Layer Transfer Process And Functionally Enhanced Integrated Circuits Produced Thereby App 20100081232 - Furman; Bruce K. ; et al.	2010-04-01
Hermetic seal and reliable bonding structures for 3D applications Grant 7,683,478 - Chen , et al. March 23, 2	2010-03-23
Cooling Apparatus And Method Of Fabrication Thereof With A Cold Plate Formed In Situ On A Surface To Be Cooled App 20090316360 - CAMPBELL; Levi A. ; et al.	2009-12-24
Electronic Package Method And Structure With Cure-melt Hierarchy App 20090179322 - FURMAN; BRUCE K ; et al.	2009-07-16
Method And Apparatus For Deploying A Liquid Metal Thermal Interface For Chip Cooling App 20090142532 - FURMAN; BRUCE K. ; et al.	2009-06-04
Hermetic Seal And Reliable Bonding Structures For 3d Applications App 20090140404 - Chen; Kuan-Neng ; et al.	2009-06-04
Thermo-compression Bonded Electrical Interconnect Structure And Method App 20090072407 - Furman; Bruce K. ; et al.	2009-03-19
Thermo-compression Bonded Electrical Interconnect Structure And Method App 20090075469 - Furman; Bruce K. ; et al.	2009-03-19
Deaggregated Electrically Conductive Polymers And Precursors Thereof App 20090032774 - Angelopoulos; Marie ; et al.	2009-02-05
Method and apparatus for deploying a liquid metal thermal interface for chip cooling Grant 7,482,197 - Furman , et al. January 27, 2	2009-01-27
Layer Transfer Process and Functionally Enhanced Integrated Circuits Products Thereby App 20080277778 - Furman; Bruce K. ; et al.	2008-11-13
Hermetic Seal And Reliable Bonding Structures For 3d Applications App 20080268574 - Chen; Kuan-Neng ; et al.	2008-10-30
Electrical Interconnect Structure And Method App 20080251281 - Buchwalter; Stephen Leslie ; et al.	2008-10-16
Patterned Metal Thermal Interface App 20080165502 - Furman; Bruce K. ; et al.	2008-07-10
Apparatus and Methods for Encapsulating Microelectromechanical (MEM) Devices on a Wafer Scale App 20080160679 - Colgan; Evan G. ; et al.	2008-07-03
Hermetic Seal And Reliable Bonding Structures For 3d Applications App 20080142958 - Chen; Kuan-Neng ; et al.	2008-06-19
Hermetic Seal And Reliable Bonding Structures For 3d Applications App 20080124835 - Chen; Kuan-Neng ; et al.	2008-05-29
Apparatus and methods for encapsulating microelectromechanical (MEM) devices on a wafer scale Grant 7,344,907 - Colgan , et al. March 18, 2	2008-03-18
Structure For Cooling A Surface App 20080053648 - FURMAN; BRUCE K. ; et al.	2008-03-06
Structure for cooling a surface Grant 7,288,840 - Furman , et al. October 30, 2	2007-10-30
Deaggregated electrically conductive polymers and precursors thereof Grant 7,288,218 - Angelopoulos , et al. October 30, 2	2007-10-30
Method and apparatus for deploying a liquid metal thermal interface for chip cooling App 20070238282 - Furman; Bruce K. ; et al.	2007-10-11
Method for isotropic etching of copper App 20060183056 - Cooper; Emanuel I. ; et al.	2006-08-17
Structure for cooling a surface App 20060157858 - Furman; Bruce K. ; et al.	2006-07-20
Fluidic cooling systems and methods for electronic components Grant 7,079,393 - Colgan , et al. July 18, 2	2006-07-18
Method and apparatus for chip cooling using a liquid metal thermal interface App 20060131738 - Furman; Bruce K. ; et al.	2006-06-22
Apparatus and methods for encapsulating microelectromechanical (MEM) devices on a wafer scale App 20060108675 - Colgan; Evan G. ; et al.	2006-05-25
Method and apparatus for providing parallel optoelectronic communication with an electronic device Grant 6,955,481 - Colgan , et al. October 18, 2	2005-10-18
Deaggregated electrically conductive polymers and precursors thereof App 20050156145 - Angelopoulos, Marie ; et al.	2005-07-21
Method for isotropic etching of copper App 20050056616 - Cooper, Emanuel I. ; et al.	2005-03-17
Method and apparatus for providing parallel optoelectronic communication with an electronic device App 20050058408 - Colgan, Evan G. ; et al.	2005-03-17
Methods of fabrication of deaggregated electrically conductive polymers and precursors thereof Grant 6,806,349 - Angelopoulos , et al. October 19, 2	2004-10-19
Deaggregated electrically conductive polymers and precursors thereof Grant 6,752,935 - Angelopoulos , et al. June 22, 2	2004-06-22
Deaggregated electrically conductive polymers and precursors thereof App 20020024039 - Angelopoulos, Marie ; et al.	2002-02-28
Methods of fabrication of deaggregated electrically conductive polymers and precursors thereof App 20010012867 - Angelopoulos, Marie ; et al.	2001-08-09
Thin-film field-effect transistor with organic semiconductor requiring low operating voltages Grant 5,981,970 - Dimitrakopoulos , et al. November 9, 1	1999-11-09
Fabrication of thin film effect transistor comprising an organic semiconductor and chemical solution deposited metal oxide gate dielectric Grant 5,946,551 - Dimitrakopoulos , et al. August 31, 1	1999-08-31
Deaggregated electrically conductive polymers and precursors thereof Grant 5,804,100 - Angelopoulos , et al. September 8, 1	1998-09-08
Method for fabricating multi-layer thin film structure having a separation layer Grant 5,534,094 - Arjavalingam , et al. July 9, 1	1996-07-09
Multi-layer thin film structure and parallel processing method for fabricating same Grant 5,258,236 - Arjavalingam , et al. November 2, 1	1993-11-02

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