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Patent applications and USPTO patent grants for Furgut; Edward.The latest application filed is for "semiconductor device including electronic component coupled to a backside of a chip".
Patent | Date |
---|---|
Electronic component with electronic chip between redistribution structure and mounting structure Grant 9,385,111 - Mengel , et al. July 5, 2 | 2016-07-05 |
Semiconductor device including electronic component coupled to a backside of a chip Grant 8,350,382 - Furgut , et al. January 8, 2 | 2013-01-08 |
Semiconductor Device Including Electronic Component Coupled To A Backside Of A Chip App 20090079065 - Furgut; Edward ;   et al. | 2009-03-26 |
Electronic component and semiconductor wafer, and method for producing the same Grant 7,420,262 - Bauer , et al. September 2, 2 | 2008-09-02 |
Electronic component and semiconductor wafer, and method for producing the same App 20040207049 - Bauer, Michael ;   et al. | 2004-10-21 |
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