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name:-0.0093147754669189
name:-0.00050711631774902
Furey; Lee Patent Filings

Furey; Lee

Patent Applications and Registrations

Patent applications and USPTO patent grants for Furey; Lee.The latest application filed is for "stacked die ground shield".

Company Profile
0.9.4
  • Furey; Lee - Phoenix AZ
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Stacked die ground shield
Grant 9,972,578 - Dix , et al. May 15, 2
2018-05-15
Stacked Die Ground Shield
App 20170287850 - Dix; Gregory ;   et al.
2017-10-05
Method and apparatus for generating regulated isolation supply voltage
Grant 8,963,622 - Lee , et al. February 24, 2
2015-02-24
Method and Apparatus for Generating Regulated Isolation Supply Voltage
App 20140253225 - Lee; Thomas Youbok ;   et al.
2014-09-11
Radio frequency identification tag device with sensor input
Grant 6,720,866 - Sorrells , et al. April 13, 2
2004-04-13
Method, system and apparatus for initiating and maintaining synchronization of a pulse position modulation (PPM) decoder with a received PPM signal
Grant 6,700,931 - Lee , et al. March 2, 2
2004-03-02
Radio frequency identification tag on a single layer substrate
Grant 6,496,113 - Lee , et al. December 17, 2
2002-12-17
Inductively tunable antenna for a radio frequency identification tag
Grant 6,480,110 - Lee , et al. November 12, 2
2002-11-12
Radio frequency identification tag on a single layer substrate
App 20020067268 - Lee, Youbok ;   et al.
2002-06-06
Radio frequency identification tag on a single layer substrate
App 20020067266 - Lee, Youbok ;   et al.
2002-06-06
Combination inductive coil and integrated circuit semiconductor chip in a single lead frame package and method therefor
Grant 6,180,433 - Furey , et al. January 30, 2
2001-01-30
Integrated circuit transporter and a method of communication therefor
Grant 6,091,935 - Alexander , et al. July 18, 2
2000-07-18
Combination inductive coil and integrated circuit semiconductor chip in a single lead frame package and method therefor
Grant 5,909,050 - Furey , et al. June 1, 1
1999-06-01

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