loadpatents
Patent applications and USPTO patent grants for Fung; Nancy.The latest application filed is for "multicolor approach to dram sti active cut patterning".
Patent | Date |
---|---|
Patterning scheme to improve EUV resist and hard mask selectivity Grant 11,437,238 - Fung , et al. September 6, 2 | 2022-09-06 |
Multicolor Approach To DRAM STI Active Cut Patterning App 20220238531 - Singh; Tejinder ;   et al. | 2022-07-28 |
Multicolor approach to DRAM STI active cut patterning Grant 11,335,690 - Singh , et al. May 17, 2 | 2022-05-17 |
Selective Anisotropic Metal Etch App 20220068661 - SHAW; Jonathan ;   et al. | 2022-03-03 |
Methods For Etching Structures With Oxygen Pulsing App 20220059366 - FUNG; Nancy ;   et al. | 2022-02-24 |
Methods For Etching Structures And Smoothing Sidewalls App 20220059365 - FUNG; Nancy ;   et al. | 2022-02-24 |
Selective Deposition Of Carbon On Photoresist Layer For Lithography Applications App 20220005688 - FUNG; NANCY ;   et al. | 2022-01-06 |
Selective Deposition Of Carbon On Photoresist Layer For Lithography Applications App 20210358751 - GAO; Larry ;   et al. | 2021-11-18 |
Multicolor Approach To DRAM STI Active Cut Patterning App 20210134807 - Singh; Tejinder ;   et al. | 2021-05-06 |
Diamond-like carbon as mandrel Grant 10,954,129 - Koshizawa , et al. March 23, 2 | 2021-03-23 |
Multicolor approach to DRAM STI active cut patterning Grant 10,910,381 - Singh , et al. February 2, 2 | 2021-02-02 |
Method of etching hardmasks containing high hardness materials Grant 10,867,795 - Fung , et al. December 15, 2 | 2020-12-15 |
Multi-tier customizable portal deployment system Grant 10,789,080 - Levy , et al. September 29, 2 | 2020-09-29 |
Multicolor Approach To DRAM STI Active Cut Patterning App 20200043932 - Singh; Tejinder ;   et al. | 2020-02-06 |
Patterning Scheme To Improve EUV Resist And Hard Mask Selectivity App 20200013620 - Fung; Nancy ;   et al. | 2020-01-09 |
Silicon addition for silicon nitride etching selectivity Grant 10,283,370 - Ros Bengoechea , et al. | 2019-05-07 |
Diamond-Like Carbon As Mandrel App 20180358229 - Koshizawa; Takehito ;   et al. | 2018-12-13 |
Methods Of Etching Hardmasks Containing High Hardness Materials App 20180337047 - FUNG; Nancy ;   et al. | 2018-11-22 |
Multi-tier Customizable Portal Deployment System App 20170017503 - Levy; Bianca Blount ;   et al. | 2017-01-19 |
Directed Block Copolymer Self-assembly Patterns For Advanced Photolithography Applications App 20140357083 - LING; Mang-Mang ;   et al. | 2014-12-04 |
Silicon oxide recess etch Grant 8,748,322 - Fung , et al. June 10, 2 | 2014-06-10 |
Method and apparatus for removing polymer from the wafer backside and edge Grant 8,329,593 - Yousif , et al. December 11, 2 | 2012-12-11 |
In-situ Process Chamber Clean To Remove Titanium Nitride Etch By-products App 20110162674 - TANG; HAIRONG ;   et al. | 2011-07-07 |
Apparatus And Method For Front Side Protection During Backside Cleaning App 20110120505 - YOUSIF; IMAD ;   et al. | 2011-05-26 |
Plasma-based Organic Mask Removal With Silicon Fluoride App 20110079918 - ZHOU; Yifeng ;   et al. | 2011-04-07 |
Apparatus and method for front side protection during backside cleaning Grant 7,879,183 - Yousif , et al. February 1, 2 | 2011-02-01 |
Method And Apparatus For Removing Polymer From A Substrate App 20090302002 - Collins; Kenneth ;   et al. | 2009-12-10 |
Heated gas box for PECVD applications Grant 7,628,863 - Sen , et al. December 8, 2 | 2009-12-08 |
Method Of Substrate Polymer Removal App 20090293907 - Fung; Nancy ;   et al. | 2009-12-03 |
Apparatus And Method For Front Side Protection During Backside Cleaning App 20090214798 - YOUSIF; IMAD ;   et al. | 2009-08-27 |
Hardmask Open Process With Enhanced Cd Space Shrink And Reduction App 20090191711 - Rui; Ying ;   et al. | 2009-07-30 |
Method and apparatus for removing polymer from the wafer backside and edge App 20090156013 - Yousif; Imad ;   et al. | 2009-06-18 |
Heated gas box for PECVD applications App 20070107660 - Sen; Soovo ;   et al. | 2007-05-17 |
Heated gas box for PECVD applications App 20060027165 - Sen; Soovo ;   et al. | 2006-02-09 |
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