Funayama; Masahiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Funayama; Masahiro.The latest application filed is for "device manufactured by room-temperature bonding, device manufacturing method, and room-temperature bonding apparatus".

Company Profile

0.9.8

Funayama; Masahiro - Yokohama JP
Funayama; Masahiro - Kanagawa N/A JP
Funayama; Masahiro - Tokyo JP
Funayama; Masahiro - Minato-ku JP
Funayama; Masahiro - Yokohama-shi JP
Funayama; Masahiro - Hirakata JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Device manufactured by room-temperature bonding, device manufacturing method, and room-temperature bonding apparatus Grant 10,112,376 - Utsumi , et al. October 30, 2	2018-10-30
Device Manufactured By Room-temperature Bonding, Device Manufacturing Method, And Room-temperature Bonding Apparatus App 20160250838 - UTSUMI; Jun ; et al.	2016-09-01
Manufcaturing method for room-temperature substrate bonding Grant 8,936,998 - Utsumi , et al. January 20, 2	2015-01-20
Room-temperature bonding method and room-temperature bonding apparatus including sputtering Grant 8,608,048 - Goto , et al. December 17, 2	2013-12-17
Room temperature bonding using sputtering Grant 8,602,289 - Goto , et al. December 10, 2	2013-12-10
Device And Device Manufacture Method App 20130213561 - UTSUMI; Jun ; et al.	2013-08-22
Semiconductor element module and method for manufacturing the same Grant 8,222,724 - Ueno , et al. July 17, 2	2012-07-17
Room-temperature Bonding Method And Room-temperature Bonding Apparatus App 20110214816 - Goto; Takayuki ; et al.	2011-09-08
Semiconductor Element Module And Method For Manufacturing The Same App 20110062600 - Ueno; Daishi ; et al.	2011-03-17
Device And Device Manufacture Method App 20100276723 - Utsumi; Jun ; et al.	2010-11-04
Device Manufactured By Room-temperature Bonding, Device Manufacturing Method, And Room-temperature Bonding Apparatus App 20100092786 - Utsumi; Jun ; et al.	2010-04-15
Room-temperature Bonding Method And Room-temperature Bonding Apparatus App 20100000663 - Goto; Takayuki ; et al.	2010-01-07
Process for the virus-inactivation of immunoglobulin Grant 4,721,777 - Uemura , et al. January 26, 1	1988-01-26

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