Funamoto; Takao

Patent Applications and Registrations

Patent applications and USPTO patent grants for Funamoto; Takao.The latest application filed is for "joining method of high carbon steel for endless hot rolling and the apparatus therefor".

Company Profile

0.15.2

Funamoto; Takao - Hitachi N/A JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Joining method of high carbon steel for endless hot rolling and the apparatus therefor Grant 8,584,923 - Lee , et al. November 19, 2	2013-11-19
Joining Method Of High Carbon Steel For Endless Hot Rolling And The Apparatus Therefor App 20110174869 - Lee; Jong-Sub ; et al.	2011-07-21
Method of bonding metal plates, apparatus therefor and hot strip mill Grant 6,955,287 - Horii , et al. October 18, 2	2005-10-18
Method of bonding metal plates, apparatus therefor and hot strip mill App 20010017312 - Horii, kenji ; et al.	2001-08-30
Method of high frequency pulse arc welding and apparatus therefor Grant 6,225,598 - Nihei , et al. May 1, 2	2001-05-01
Gas turbine nozzle, power generation gas turbine, co-base alloy and welding material Grant 6,077,615 - Yada , et al. June 20, 2	2000-06-20
Submerged laser beam irradiation equipment Grant 5,938,954 - Onuma , et al. August 17, 1	1999-08-17
Superconducting magnetic field generating apparatus and method of producing the same Grant 5,231,366 - Haramaki , et al. July 27, 1	1993-07-27
Joined body of high-temperature oxide superconductor and method of joining oxide superconductors Grant 5,051,397 - Sato , et al. September 24, 1	1991-09-24
Water-turbine runner and process for manufacturing the same Grant 5,035,579 - Yada , et al. July 30, 1	1991-07-30
Semiconductor module and cooling device of the same Grant 4,996,589 - Kajiwara , et al. February 26, 1	1991-02-26
Method of joining an insulated wire to a conductive terminal Grant 4,902,867 - Haramaki , et al. February 20, 1	1990-02-20
Integrated circuit device Grant 4,809,058 - Funamoto , et al. February 28, 1	1989-02-28
Sealed-type liquid cooling device with expandable bellow for semiconductor chips Grant 4,740,866 - Kajiwara , et al. April 26, 1	1988-04-26
Diffusion bonding method using a high energy beam Grant 4,691,856 - Haramaki , et al. September 8, 1	1987-09-08
Method of brazing an aluminum heat exchanger Grant 4,645,119 - Haramaki , et al. February 24, 1	1987-02-24

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