Funaki; Takeshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Funaki; Takeshi.The latest application filed is for "medicinal composition for inhalation".

Company Profile

2.5.8

Funaki; Takeshi - Hyogo JP
Funaki; Takeshi - Osaka JP
Funaki; Takeshi - Osaka-Shi JP
Funaki; Takeshi - Fukuoka-ken JP
Funaki; Takeshi - Musashino JP
Funaki, Takeshi - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Medicinal composition for inhalation Grant 11,304,937 - Funaki , et al. April 19, 2	2022-04-19
Medicinal Composition For Inhalation App 20190231764 - FUNAKI; Takeshi ; et al.	2019-08-01
Nitride semiconductor structure, nitride semiconductor light emitting element, nitride semiconductor transistor element, method of manufacturing nitride semiconductor structure, and method of manufacturing nitride semiconductor element Grant 8,963,165 - Araki , et al. February 24, 2	2015-02-24
Nitride Semiconductor Structure, Nitride Semiconductor Light Emitting Element, Nitride Semiconductor Transistor Element, Method Of Manufacturing Nitride Semiconductor Structure, And Method Of Manufacturing Nitride Semiconductor Element App 20130277684 - Araki; Masahiro ; et al.	2013-10-24
Method for production of coated preparations Grant 8,349,387 - Funaki , et al. January 8, 2	2013-01-08
Film Composition App 20110054043 - Funaki; Takeshi ; et al.	2011-03-03
Solid Preparation Comprising Npyy5 Receptor Antagonist App 20100240711 - Takada; Masatoshi ; et al.	2010-09-23
Method For Production Of Coated Preparations App 20100203228 - Funaki; Takeshi ; et al.	2010-08-12
Rubber product with fiber reinforcing layer and method for producing the same App 20060223399 - Kurimoto; Hidekazu ; et al.	2006-10-05
Substrate for use in package of semiconductor device, semiconductor package using the substrate, and methods for manufacturing the substrate and the semiconductor package Grant 6,708,398 - Wakashima , et al. March 23, 2	2004-03-23
Substrate for use in package of semiconductor device, semiconductor package using the substrate, and methods for manufacturing the substrate and the semiconductor package App 20020020909 - Wakashima, Yoshiaki ; et al.	2002-02-21

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