loadpatents
Patent applications and USPTO patent grants for Funaki; Shinichi.The latest application filed is for "copper alloy plate, copper alloy plate with plating film, and manufacturing method thereof".
Patent | Date |
---|---|
Copper Alloy Plate, Copper Alloy Plate With Plating Film, And Manufacturing Method Thereof App 20220145424 - Miyashima; Naoki ;   et al. | 2022-05-12 |
Copper Alloy Plate, Plating Film-attached Copper Alloy Plate, And Methods Respectively For Manufacturing These Products App 20220081738 - Miyashima; Naoki ;   et al. | 2022-03-17 |
Tin-plated Copper Terminal Material And Method Of Manufacturing The Same App 20210108325 - Mawatari; Fuyumi ;   et al. | 2021-04-15 |
Terminal material for connectors and method for producing same Grant 10,923,245 - Inoue , et al. February 16, 2 | 2021-02-16 |
Terminal Material For Connectors And Method For Producing Same App 20190362865 - Inoue; Yuki ;   et al. | 2019-11-28 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.