Funada, Yoshitsugu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Funada, Yoshitsugu.The latest application filed is for "molded resin composition exhibiting good adhesion to conductive material on a surface".
- Funada, Yoshitsugu - Tokyo JP
| Patent | Date |
|---|---|
| Molded resin composition exhibiting good adhesion to conductive material on a surface App 20010011111 - Funada, Yoshitsugu ; et al. | 2001-08-02 |
| Resin film and a method for connecting electronic parts by the use thereof Grant 6,214,446 - Funada , et al. April 10, 2 | 2001-04-10 |
| Surface acoustic wave device mounted with a resin film and method of making same Grant 6,078,229 - Funada , et al. June 20, 2 | 2000-06-20 |
| Method of manufacturing a tab semiconductor device Grant 5,972,739 - Funada , et al. October 26, 1 | 1999-10-26 |
| Interconnection structures and method of making same Grant 5,830,563 - Shimoto , et al. November 3, 1 | 1998-11-03 |
| Multilayer printed circuit board Grant 5,372,872 - Funada , et al. December 13, 1 | 1994-12-13 |
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