Funada; Yasuhito
Patent Applications and Registrations
Patent applications and USPTO patent grants for Funada; Yasuhito.The latest application filed is for "wired circuit board and producing method thereof".
- Funada; Yasuhito - Osaka JP
- Funada; Yasuhito - Ibaraki JP
- Funada; Yasuhito - Ibaraki-shi JP
| Patent | Date |
|---|---|
| Wired circuit board Grant 8,134,080 - Ishii , et al. March 13, 2 | 2012-03-13 |
| Wired circuit board having a semiconductive grounding layer and producing method thereof Grant 8,071,886 - Ishii , et al. December 6, 2 | 2011-12-06 |
| Wired circuit board Grant 7,638,873 - Ishii , et al. December 29, 2 | 2009-12-29 |
| Wired circuit board Grant 7,586,046 - Ishii , et al. September 8, 2 | 2009-09-08 |
| Wired circuit board and production method thereof Grant 7,566,833 - Ishii , et al. July 28, 2 | 2009-07-28 |
| Wired circuit board and producing method thereof App 20090142478 - Funada; Yasuhito ; et al. | 2009-06-04 |
| Suspension board with circuit Grant 7,531,753 - Funada , et al. May 12, 2 | 2009-05-12 |
| Suspension board with circuit Grant 7,525,764 - Ohsawa , et al. April 28, 2 | 2009-04-28 |
| Wired circuit board and producing method thereof Grant 7,501,581 - Funada , et al. March 10, 2 | 2009-03-10 |
| Wired circuit board Grant 7,471,519 - Ooyabu , et al. December 30, 2 | 2008-12-30 |
| Wired circuit board and producing method thereof App 20080149361 - ISHII; Jun ; et al. | 2008-06-26 |
| Suspension board having a circuit and a flying lead portion Grant 7,336,446 - Kanagawa , et al. February 26, 2 | 2008-02-26 |
| Wired circuit board assembly Grant 7,307,853 - Funada , et al. December 11, 2 | 2007-12-11 |
| Wired circuit board and producing method thereof App 20070131449 - Funada; Yasuhito ; et al. | 2007-06-14 |
| Wired circuit board App 20070128417 - Ishii; Jun ; et al. | 2007-06-07 |
| Wired circuit board App 20070051534 - Ishii; Jun ; et al. | 2007-03-08 |
| Wired circuit board Grant 7,182,606 - Ishii , et al. February 27, 2 | 2007-02-27 |
| Wired circuit board App 20070017695 - Ishii; Jun ; et al. | 2007-01-25 |
| Wired circuit board and production method thereof App 20060269730 - Ishii; Jun ; et al. | 2006-11-30 |
| Wired circuit board App 20060199402 - Ishii; Jun ; et al. | 2006-09-07 |
| Wired circuit board assembly App 20060169486 - Funada; Yasuhito ; et al. | 2006-08-03 |
| Wiring circuit board and production method thereof Grant 7,084,493 - Funada , et al. August 1, 2 | 2006-08-01 |
| Suspension board with circuit App 20060087769 - Ohsawa; Tetsuya ; et al. | 2006-04-27 |
| Photosensitive resin composition and use of the same Grant 7,008,752 - Fujii , et al. March 7, 2 | 2006-03-07 |
| Wired circuit board App 20060023435 - Ooyabu; Yasunari ; et al. | 2006-02-02 |
| Suspension board with circuit App 20050248885 - Funada, Yasuhito ; et al. | 2005-11-10 |
| Photosensitive resin composition and use of the same App 20050208421 - Fujii, Hirofumi ; et al. | 2005-09-22 |
| Production method of suspension board with circuit App 20050186332 - Funada, Yasuhito ; et al. | 2005-08-25 |
| Wiring circuit board and production method thereof App 20050161775 - Funada, Yasuhito ; et al. | 2005-07-28 |
| Suspension board with circuit App 20050122627 - Kanagawa, Hitoki ; et al. | 2005-06-09 |
| Circuit substrate, circuit-formed suspension substrate, and production method thereof Grant 6,100,582 - Omote , et al. August 8, 2 | 2000-08-08 |
| Circuit substrate, circuit-formed suspension substrate, and production method thereof Grant 6,096,482 - Omote , et al. August 1, 2 | 2000-08-01 |
| Circuit substrate, circuit-formed suspension substrate, and production method thereof Grant 5,858,518 - Omote , et al. January 12, 1 | 1999-01-12 |
| Process for producing electrically conductive organic polymer composition Grant 5,578,249 - Ohtani , et al. November 26, 1 | 1996-11-26 |
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