Patent | Date |
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Blockchain ledgers of material spectral signatures for supply chain integrity management Grant 11,195,145 - Fuller , et al. December 7, 2 | 2021-12-07 |
Offering application program interfaces (APIs) for sale in cloud marketplace Grant 10,721,328 - Chen , et al. | 2020-07-21 |
Blockchain ledgers of material spectral signatures for supply chain integrity management Grant 10,685,323 - Fuller , et al. | 2020-06-16 |
High selectivity nitride removal process based on selective polymer deposition Grant 10,651,286 - Dasaka , et al. | 2020-05-12 |
Blockchain Ledgers Of Material Spectral Signatures For Supply Chain Integrity Management App 20200051008 - Fuller; Nicholas C. M. ;   et al. | 2020-02-13 |
Blockchain ledgers of material spectral signatures for supply chain integrity management Grant 10,467,586 - Fuller , et al. No | 2019-11-05 |
High Selectivity Nitride Removal Process Based On Selective Polymer Deposition App 20190305109 - Dasaka; Ravi K. ;   et al. | 2019-10-03 |
High selectivity nitride removal process based on selective polymer deposition Grant 10,325,998 - Dasaka , et al. | 2019-06-18 |
High selectivity nitride removal process based on selective polymer deposition Grant 10,269,924 - Dasaka , et al. | 2019-04-23 |
Automatic generation of license terms for service application marketplaces Grant 10,216,486 - Fuller , et al. Feb | 2019-02-26 |
Blockchain Ledgers Of Material Spectral Signatures For Supply Chain Integrity Management App 20180276600 - Fuller; Nicholas C. M. ;   et al. | 2018-09-27 |
Blockchain Ledgers Of Material Spectral Signatures For Supply Chain Integrity Management App 20180276597 - Fuller; Nicholas C. M. ;   et al. | 2018-09-27 |
Pattern-based product identification with feedback Grant 10,043,153 - Fan , et al. August 7, 2 | 2018-08-07 |
High Selectivity Nitride Removal Process Based On Selective Polymer Deposition App 20170194497 - Dasaka; Ravi K. ;   et al. | 2017-07-06 |
High Selectivity Nitride Removal Process Based On Selective Polymer Deposition App 20170194457 - Dasaka; Ravi K. ;   et al. | 2017-07-06 |
Low energy etch process for nitrogen-containing dielectric layer Grant 9,633,948 - Brink , et al. April 25, 2 | 2017-04-25 |
High selectivity nitride removal process based on selective polymer deposition Grant 9,627,533 - Dasaka , et al. April 18, 2 | 2017-04-18 |
Offering Application Program Interfaces (apis) For Sale In Cloud Marketplace App 20170064038 - Chen; Han ;   et al. | 2017-03-02 |
Automatic Generation Of License Terms For Service Application Marketplaces App 20160364213 - Fuller; Nicholas C. M. ;   et al. | 2016-12-15 |
Automatic generation of license terms for service application marketplaces Grant 9,460,273 - Fuller , et al. October 4, 2 | 2016-10-04 |
High Selectivity Nitride Removal Process Based On Selective Polymer Deposition App 20160233335 - Dasaka; Ravi K. ;   et al. | 2016-08-11 |
Dynamic parallel distributed job configuration in a shared-resource environment Grant 9,405,582 - Fuller , et al. August 2, 2 | 2016-08-02 |
Automatic Generation Of License Terms For Service Application Marketplaces App 20160125172 - Fuller; Nicholas C. M. ;   et al. | 2016-05-05 |
Low Energy Etch Process For Nitrogen-containing Dielectric Layer App 20160111374 - Brink; Markus ;   et al. | 2016-04-21 |
Sputter and surface modification etch processing for metal patterning in integrated circuits Grant 9,263,393 - Cabral, Jr. , et al. February 16, 2 | 2016-02-16 |
Pattern-based Product Identification With Feedback App 20160026968 - Fan; Liya ;   et al. | 2016-01-28 |
Dynamic Parallel Distributed Job Configuration In A Shared-resource Environment App 20150370603 - Fuller; Nicholas C. M. ;   et al. | 2015-12-24 |
Low energy etch process for nitrogen-containing dielectric layer Grant 9,190,316 - Brink , et al. November 17, 2 | 2015-11-17 |
Sputter And Surface Modification Etch Processing For Metal Patterning In Integrated Circuits App 20150243602 - Cabral, JR.; Cyril ;   et al. | 2015-08-27 |
Sputter and surface modification etch processing for metal patterning in integrated circuits Grant 9,064,727 - Cabral, Jr. , et al. June 23, 2 | 2015-06-23 |
Borderless self-aligned metal contact patterning using printable dielectric materials Grant 9,018,090 - Chang , et al. April 28, 2 | 2015-04-28 |
High aspect ratio and reduced undercut trench etch process for a semiconductor substrate Grant 8,928,124 - Fuller , et al. January 6, 2 | 2015-01-06 |
High fidelity patterning employing a fluorohydrocarbon-containing polymer Grant 8,916,054 - Brink , et al. December 23, 2 | 2014-12-23 |
Subtractive plasma etching of a blanket layer of metal or metal alloy Grant 8,871,107 - Fuller , et al. October 28, 2 | 2014-10-28 |
Solar cells with plated back side surface field and back side electrical contact and method of fabricating same Grant 8,865,502 - Fisher , et al. October 21, 2 | 2014-10-21 |
Subtractive Plasma Etching Of A Blanket Layer Of Metal Or Metal Alloy App 20140273437 - Fuller; Nicholas C. M. ;   et al. | 2014-09-18 |
High selectivity nitride etch process Grant 8,765,613 - Chang , et al. July 1, 2 | 2014-07-01 |
Base station power control in a mobile network Grant 8,768,337 - Fuller , et al. July 1, 2 | 2014-07-01 |
Base station power control in a mobile network Grant 8,768,338 - Fuller , et al. July 1, 2 | 2014-07-01 |
Sputter And Surface Modification Etch Processing For Metal Patterning In Integrated Circuits App 20140124935 - CABRAL, JR.; CYRIL ;   et al. | 2014-05-08 |
Sputter And Surface Modification Etch Processing For Metal Patterning In Integrated Circuits App 20140127906 - Cabral, JR.; Cyril ;   et al. | 2014-05-08 |
Sputter And Surface Modification Etch Processing For Metal Patterning In Integrated Circuits App 20140124870 - Cabral, JR.; Cyril ;   et al. | 2014-05-08 |
Base Station Power Control In A Mobile Network App 20140120903 - Fuller; Nicholas C. M. ;   et al. | 2014-05-01 |
Base Station Power Control In A Mobile Network App 20140120904 - Fuller; Nicholas C. M. ;   et al. | 2014-05-01 |
High aspect ratio and reduced undercut trench etch process for a semiconductor substrate Grant 8,652,969 - Fuller , et al. February 18, 2 | 2014-02-18 |
Sputter and surface modification etch processing for metal patterning in integrated circuits Grant 8,633,117 - Cabral , et al. January 21, 2 | 2014-01-21 |
Aqueous cerium-containing solution having an extended bath lifetime for removing mask material Grant 8,618,036 - Afzali-Ardakani , et al. December 31, 2 | 2013-12-31 |
Aqueous cerium-containing solution having an extended bath lifetime for removing mask material Grant 08618036 - | 2013-12-31 |
High Aspect Ratio And Reduced Undercut Trench Etch Process For A Semiconductor Substrate App 20130328173 - Fuller; Nicholas C. M. ;   et al. | 2013-12-12 |
Use Of An Organic Planarizing Mask For Cutting A Plurality Of Gate Lines App 20130143397 - Fuller; Nicholas C.M. ;   et al. | 2013-06-06 |
Use of an organic planarizing mask for cutting a plurality of gate lines Grant 8,455,366 - Fuller , et al. June 4, 2 | 2013-06-04 |
Gate patterning of nano-channel devices Grant 8,445,948 - Fuller , et al. May 21, 2 | 2013-05-21 |
Aqueous Cerium-containing Solution Having An Extended Bath Lifetime For Removing Mask Material App 20130123159 - Afzali-Ardakani; Ali ;   et al. | 2013-05-16 |
High Fidelity Patterning Employing A Fluorohydrocarbon-containing Polymer App 20130108833 - Brink; Markus ;   et al. | 2013-05-02 |
Low Energy Etch Process For Nitrogen-containing Dielectric Layer App 20130105996 - Brink; Markus ;   et al. | 2013-05-02 |
High Selectivity Nitride Etch Process App 20130105916 - Chang; Josephine B. ;   et al. | 2013-05-02 |
High Aspect Ratio And Reduced Undercut Trench Etch Process For A Semiconductor Substrate App 20130105947 - Fuller; Nicholas C. M. ;   et al. | 2013-05-02 |
Borderless Self-aligned Metal Contact Patterning Using Printable Dielectric Materials App 20130087860 - Chang; Josephine B. ;   et al. | 2013-04-11 |
Use of an organic planarizing mask for cutting a plurality of gate lines Grant 8,367,556 - Fuller , et al. February 5, 2 | 2013-02-05 |
Solar Cells With Plated Back Side Surface Field And Back Side Electrical Contact And Method Of Fabricating Same App 20120325312 - Fisher; Kathryn C. ;   et al. | 2012-12-27 |
Structure With Isotropic Silicon Recess Profile In Nanoscale Dimensions App 20120193680 - Engelmann; Sebastian Ulrich ;   et al. | 2012-08-02 |
Structure With Isotropic Silicon Recess Profile In Nanoscale Dimensions App 20120193715 - Engelmann; Sebastian Ulrich ;   et al. | 2012-08-02 |
Structure with isotropic silicon recess profile in nanoscale dimensions Grant 8,232,171 - Engelmann , et al. July 31, 2 | 2012-07-31 |
Solar Cells With Plated Back Side Surface Field And Back Side Electrical Contact And Method Of Fabricating Same App 20110303274 - Fisher; Kathryn C. ;   et al. | 2011-12-15 |
Sublithographic patterning method incorporating a self-aligned single mask process Grant 7,960,096 - Abraham , et al. June 14, 2 | 2011-06-14 |
Sub-lithographic dimensioned air gap formation and related structure Grant 7,943,480 - Edelstein , et al. May 17, 2 | 2011-05-17 |
Resist stripping methods using backfilling material layer Grant 7,935,637 - Fuller , et al. May 3, 2 | 2011-05-03 |
Structure With Isotropic Silicon Recess Profile In Nanoscale Dimensions App 20110062494 - Engelmann; Sebastian Ulrich ;   et al. | 2011-03-17 |
Gate Patterning Of Nano-channel Devices App 20110006367 - Fuller; Nicholas C.M. ;   et al. | 2011-01-13 |
Gate patterning of nano-channel devices Grant 7,816,275 - Fuller , et al. October 19, 2 | 2010-10-19 |
Multilayer hardmask scheme for damage-free dual damascene processing of SiCOH dielectrics Grant 7,811,926 - Fuller , et al. October 12, 2 | 2010-10-12 |
Gate Patterning Of Nano-channel Devices App 20100252810 - Fuller; Nicholas C. M. ;   et al. | 2010-10-07 |
Method of forming an interconnection structure in a organosilicate glass having a porous layer with higher carbon content located between two lower carbon content non-porous layers Grant 7,767,587 - Fuller , et al. August 3, 2 | 2010-08-03 |
Systems and methods for building and implementing ontology-based information resources Grant 7,739,218 - Arguello , et al. June 15, 2 | 2010-06-15 |
Sublithographic Patterning Method Incorporating A Self-aligned Single Mask Process App 20090202952 - Abraham; David W. ;   et al. | 2009-08-13 |
Sub-lithographic Dimensioned Air Gap Formation And Related Structure App 20090200636 - Edelstein; Daniel C. ;   et al. | 2009-08-13 |
Semiconductor interconnect structure utilizing a porous dielectric material as an etch stop layer between adjacent non-porous dielectric materials Grant 7,504,727 - Fuller , et al. March 17, 2 | 2009-03-17 |
Resist Stripping Methods Using Backfilling Material Layer App 20090047784 - Fuller; Nicholas C.M. ;   et al. | 2009-02-19 |
Waveguide polarization beam splitters and method of fabricating a waveguide wire-grid polarization beam splitter Grant 7,486,845 - Black , et al. February 3, 2 | 2009-02-03 |
MULTILAYER HARDMASK SCHEME FOR DAMAGE-FREE DUAL DAMASCENE PROCESSING OF SiCOH DIELECTRICS App 20080311744 - Fuller; Nicholas C.M. ;   et al. | 2008-12-18 |
Multi-layer Mask Method For Patterned Structure Ethcing App 20080305437 - Fuller; Nicholas C.M. ;   et al. | 2008-12-11 |
Two Step Photoresist Stripping Method Sequentially Using Ion Activated And Non-ion Activated Nitrogen Containing Plasmas App 20080303069 - Fuller; Nicholas C.M. ;   et al. | 2008-12-11 |
Multilayer hardmask scheme for damage-free dual damascene processing of SiCOH dielectrics Grant 7,439,174 - Dalton , et al. October 21, 2 | 2008-10-21 |
Waveguide Polarization Beam Splitters And Method Of Fabricating A Waveguide Wire-grid Polarization Beam Splitter App 20080175527 - Black; Charles T. ;   et al. | 2008-07-24 |
Use Of A Porous Dielectric Material As An Etch Stop Layer For Non-porous Dielectric Films App 20080146037 - Fuller; Nicholas C.M. ;   et al. | 2008-06-19 |
Multilayer hardmask scheme for damage-free dual damascene processing of SiCOH dielectrics Grant 7,371,461 - Fuller , et al. May 13, 2 | 2008-05-13 |
Multiple layer resist scheme implementing etch recipe particular to each layer Grant 7,352,064 - Fuller , et al. April 1, 2 | 2008-04-01 |
MULTILAYER HARDMASK SCHEME FOR DAMAGE-FREE DUAL DAMASCENE PROCESSING OF SiCOH DIELECTRICS App 20080038917 - Dalton; Timothy J. ;   et al. | 2008-02-14 |
Waveguide polarization beam splitters and method of fabricating a waveguide wire-grid polarization beam splitter Grant 7,298,935 - Black , et al. November 20, 2 | 2007-11-20 |
Waveguide Polarization Beam Splitters And Method Of Fabricating A Waveguide Wire-grid Polarization Beam Splitter App 20070253661 - Black; Charles T. ;   et al. | 2007-11-01 |
High ion energy and reative species partial pressure plasma ash process Grant 7,253,116 - Fuller , et al. August 7, 2 | 2007-08-07 |
Preventing Damage To Interlevel Dielectric App 20070072412 - Dunn; Derren N. ;   et al. | 2007-03-29 |
Method For Protecting A Semiconductor Device From Carbon Depletion Based Damage App 20070048981 - Bonilla; Griselda ;   et al. | 2007-03-01 |
Systems and methods for building and implementing ontology-based information resources App 20070043742 - Arguello; Juan Fernando ;   et al. | 2007-02-22 |
Multilayer hardmask scheme for damage-free dual damascene processing of SiCOH dielectrics App 20060154086 - Fuller; Nicholas C.M. ;   et al. | 2006-07-13 |
De-fluorination of wafer surface and related structure Grant 7,049,209 - Dalton , et al. May 23, 2 | 2006-05-23 |
Multiple Layer Resist Scheme Implementing Etch Recipe Particular to Each Layer App 20060094230 - Fuller; Nicholas C.M. ;   et al. | 2006-05-04 |
Use of a porous dielectric material as an etch stop layer for non-porous dielectric films App 20050258542 - Fuller, Nicholas C.M. ;   et al. | 2005-11-24 |
Photoresist ash process with reduced inter-level dielectric ( ILD) damage App 20050077629 - Dalton, Timothy J. ;   et al. | 2005-04-14 |