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Patent applications and USPTO patent grants for Fuller; Jason L..The latest application filed is for "microelectronic device having a plurality of stacked microelectronic dies and methods for manufacturing such microelectronic assemblies".
Patent | Date |
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Electronic device package Grant 7,485,971 - Fuller , et al. February 3, 2 | 2009-02-03 |
Microelectronic Device Having A Plurality Of Stacked Microelectronic Dies And Methods For Manufacturing Such Microelectronic Assemblies App 20080054452 - Fuller; Jason L. ;   et al. | 2008-03-06 |
Microelectronic device having a plurality of stacked dies and methods for manufacturing such microelectronic assemblies Grant 7,198,693 - Fuller , et al. April 3, 2 | 2007-04-03 |
Electronic device package Grant 7,084,515 - Fuller , et al. August 1, 2 | 2006-08-01 |
Electronic device package App 20060006553 - Fuller; Jason L. ;   et al. | 2006-01-12 |
Electronic device package App 20050287706 - Fuller, Jason L. ;   et al. | 2005-12-29 |
Electronic device package Grant 6,969,914 - Fuller , et al. November 29, 2 | 2005-11-29 |
Electronic device package App 20050023572 - Fuller, Jason L. ;   et al. | 2005-02-03 |
Electronic device package App 20040041279 - Fuller, Jason L. ;   et al. | 2004-03-04 |
Microelectronic assembly with pre-disposed fill material and associated method of manufacture Grant 6,661,104 - Jiang , et al. December 9, 2 | 2003-12-09 |
Microelectronic assembly with pre-disposed fill material and associated method of manufacture App 20020025602 - Jiang, Tongbi ;   et al. | 2002-02-28 |
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