Fulcher; Edwin
Patent Applications and Registrations
Patent applications and USPTO patent grants for Fulcher; Edwin.The latest application filed is for "method of assembling ball bump grid array semiconductor packages".
- Fulcher; Edwin - Palo Alto CA
| Patent | Date |
|---|---|
| Method of assembling ball bump grid array semiconductor packages Grant 5,729,894 - Rostoker , et al. March 24, 1 | 1998-03-24 |
| Flip chip package with reduced number of package layers Grant 5,686,764 - Fulcher November 11, 1 | 1997-11-11 |
| Integrated circuit wafer comprising unsingulated dies, and decoder arrangement for individually testing the dies Grant 5,648,661 - Rostoker , et al. * July 15, 1 | 1997-07-15 |
| Heat sink for semiconductor device assembly Grant 5,311,060 - Rostoker , et al. May 10, 1 | 1994-05-10 |
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