FUKUYO; Hideaki
Patent Applications and Registrations
Patent applications and USPTO patent grants for FUKUYO; Hideaki.The latest application filed is for "copper electrode material".
- FUKUYO; Hideaki - Tokyo JP
- FUKUYO; Hideaki - Ibaraki JP
- Fukuyo; Hideaki - Kitaibaraki JP
- Fukuyo; Hideaki - Kitaibaraka JP
| Patent | Date |
|---|---|
| Copper Electrode Material App 20210359482 - TAKAHATA; Masahiro ; et al. | 2021-11-18 |
| Sintered Compact Target And Method Of Producing Sintered Compact App 20210237153 - FUKUYO; Hideaki ; et al. | 2021-08-05 |
| Method for vacuum packing high-purity tin and vacuum-packed high purity tin Grant 10,781,024 - Imori , et al. Sept | 2020-09-22 |
| Method For Vacuum Packing High-purity Tin And Vacuum-packed High Purity Tin App 20190055077 - IMORI; Toru ; et al. | 2019-02-21 |
| Sintered Compact Target And Method Of Producing Sintered Compact App 20180085828 - Fukuyo; Hideaki ; et al. | 2018-03-29 |
| Titanium target for sputtering Grant 9,068,258 - Tsukamoto , et al. June 30, 2 | 2015-06-30 |
| Titanium Target for Sputtering App 20130186753 - Tsukamoto; Shiro ; et al. | 2013-07-25 |
| Sintered Compact Target and Method of Producing Sintered Compact App 20110017590 - Fukuyo; Hideaki ; et al. | 2011-01-27 |
| Titanium target for sputtering Grant 6,755,948 - Fukuyo , et al. June 29, 2 | 2004-06-29 |
| High purity titanium sputtering targets Grant 5,772,860 - Sawada , et al. June 30, 1 | 1998-06-30 |
| Sputtering target assembly having solid-phase bonded interface Grant 5,693,203 - Ohhashi , et al. December 2, 1 | 1997-12-02 |
| Sputtering targets of high-purity aluminum or alloy thereof Grant 5,456,815 - Fukuyo , et al. October 10, 1 | 1995-10-10 |
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