Fukutomi; Naoki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fukutomi; Naoki.The latest application filed is for "composition for normalizing blood pressure".

Company Profile

0.15.5

Fukutomi; Naoki - Osaka JP
Fukutomi; Naoki - Yuki JP
Fukutomi, Naoki - Yuki-shi JP
Fukutomi; Naoki - Tokyo JP
Fukutomi; Naoki - Shimodate JA
Fukutomi; Naoki - Shimodate-shi JA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Composition For Normalizing Blood Pressure App 20090098097 - Ikehara; Toshinori ; et al.	2009-04-16
Fabrication process of semiconductor package and semiconductor package Grant 7,187,072 - Fukutomi , et al. March 6, 2	2007-03-06
Fabrication process of semiconductor package and semiconductor package App 20040110319 - Fukutomi, Naoki ; et al.	2004-06-10
Fabrication process of semiconductor package and semiconductor package Grant 6,746,897 - Fukutomi , et al. June 8, 2	2004-06-08
Substrate for use in package of semiconductor device, semiconductor package using the substrate, and methods for manufacturing the substrate and the semiconductor package Grant 6,708,398 - Wakashima , et al. March 23, 2	2004-03-23
Process for the fabrication of wiring board for electrical tests Grant 6,568,073 - Fukutomi , et al. May 27, 2	2003-05-27
Semiconductor device and method of fabrication thereof Grant 6,492,203 - Wakashima , et al. December 10, 2	2002-12-10
Fabrication process of semiconductor package and semiconductor package App 20020094606 - Fukutomi, Naoki ; et al.	2002-07-18
Fabrication process of semiconductor package and semiconductor package App 20020039808 - Fukutomi, Naoki ; et al.	2002-04-04
Substrate for use in package of semiconductor device, semiconductor package using the substrate, and methods for manufacturing the substrate and the semiconductor package App 20020020909 - Wakashima, Yoshiaki ; et al.	2002-02-21
Board for mounting semiconductor element, method for manufacturing the same, and semiconductor device Grant 6,268,648 - Fukutomi , et al. July 31, 2	2001-07-31
Fabrication process of semiconductor package and semiconductor package Grant 5,976,912 - Fukutomi , et al. November 2, 1	1999-11-02
Photolithographically viahole-forming photosensitive element comprising two photosensitive layers for the fabrication process of multilayer wiring board Grant 5,532,105 - Yamadera , et al. July 2, 1	1996-07-02
Fabrication process of wiring board Grant 5,504,992 - Fukutomi , et al. April 9, 1	1996-04-09
Fabrication process of wiring board Grant 5,426,850 - Fukutomi , et al. June 27, 1	1995-06-27
Process for producing printed wiring boards Grant 5,153,987 - Takahashi , et al. October 13, 1	1992-10-13
Process for producing high-density wiring board Grant 4,830,691 - Kida , et al. May 16, 1	1989-05-16
High-density wired circuit board using insulated wires Grant 4,791,238 - Kanno , et al. December 13, 1	1988-12-13
Method Of Making A Wire Memory Plane Grant 3,816,909 - Maeda , et al. June 18, 1	1974-06-18
Method For Connecting Conductors Grant 3,646,670 - Maeda , et al. March 7, 1	1972-03-07

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