Fukutake; Sunao

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fukutake; Sunao.The latest application filed is for "surface-treated copper foil, and copper-clad laminate and circuit board using same".

Company Profile

3.8.4

Fukutake; Sunao - Nagaokakyo JP
FUKUTAKE; Sunao - Nagaokakyo-shi JP
Fukutake; Sunao - Kyoto JP
Fukutake; Sunao - Okayama JP
Fukutake; Sunao - Ibaraki JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Black liquid-crystal polymer film and multilayer board Grant 11,365,353 - Nishi , et al. June 21, 2	2022-06-21
Surface-treated Copper Foil, And Copper-clad Laminate And Circuit Board Using Same App 20210212204 - TSURUTA; Takahiro ; et al.	2021-07-08
Metal-clad laminate, circuit board, and multilayer circuit board Grant 10,959,330 - Ohashi , et al. March 23, 2	2021-03-23
Surface-treated copper foil, and copper-clad laminate and printed wiring board using same Grant 10,701,811 - Uno , et al.	2020-06-30
Surface-treated Copper Foil, And Copper-clad Laminate And Printed Wiring Board Using Same App 20200029444 - UNO; Takeo ; et al.	2020-01-23
Metal-clad Laminate, Circuit Board, And Multilayer Circuit Board App 20190357355 - Ohashi; Kazuhiko ; et al.	2019-11-21
Black Liquid-crystal Polymer Film And Multilayer Board App 20190352565 - NISHI; Yoshimasa ; et al.	2019-11-21
LCD article from liquid crystal filled, hydrophilically-coated, porous PTFE film Grant 5,580,618 - Okino , et al. December 3, 1	1996-12-03
Printed circuit board with a coverlay film Grant 5,473,118 - Fukutake , et al. December 5, 1	1995-12-05
Composite layered material containing a silicone resin substrate Grant 5,294,487 - Ohashi , et al. March 15, 1	1994-03-15
Ceramic substrate material containing an amorphous fluorine resin Grant 5,116,663 - Fujimoto , et al. May 26, 1	1992-05-26
Semiconductor device and the manufacture thereof Grant 5,061,990 - Arakawa , et al. October 29, 1	1991-10-29

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