Fukushima; Yoshifumi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Fukushima; Yoshifumi.The latest application filed is for "semiconductor integrated circuit".
- Fukushima; Yoshifumi - Shimada N/A JP
- Fukushima; Yoshifumi - Kyoto N/A JP
- Fukushima; Yoshifumi - Shimada-shi JP
- Fukushima; Yoshifumi - Suita JP
| Patent | Date |
|---|---|
| Method of manufacturing metallic decorative member Grant 8,632,716 - Fukushima January 21, 2 | 2014-01-21 |
| Semiconductor integrated circuit Grant 8,446,792 - Fukushima , et al. May 21, 2 | 2013-05-21 |
| Semiconductor Integrated Circuit App 20110255353 - FUKUSHIMA; Yoshifumi ; et al. | 2011-10-20 |
| Method of manufacturing metallic decorative member App 20110248426 - Fukushima; Yoshifumi | 2011-10-13 |
| Highly weather-resistant, single package, crosslinkable emulsion Grant 5,534,579 - Nikaya , et al. July 9, 1 | 1996-07-09 |
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