Fukushima; Dai

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fukushima; Dai.The latest application filed is for "polishing device, polishing method, and record medium".

Company Profile

1.30.40

Fukushima; Dai - Kuwana JP
Fukushima; Dai - Kanagawa N/A JP
Fukushima; Dai - Kamakura JP
Fukushima; Dai - Sagamihara JP
Fukushima; Dai - Oita-shi JP
Fukushima; Dai - Kamakura-shi JP
FUKUSHIMA; Dai - Oita-ken JP
Fukushima; Dai - Sagamihara-shi JP
Fukushima; Dai - Tokyo JP
Fukushima; Dai - Fujisawa JP
Fukushima, Dai - Fujisawa-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Polishing device, polishing method, and record medium Grant 11,097,397 - Watanabe , et al. August 24, 2	2021-08-24
Cleaning apparatus and cleaning method Grant 10,441,979 - Takagi , et al. Oc	2019-10-15
Polishing Device, Polishing Method, And Record Medium App 20190039206 - Watanabe; Takashi ; et al.	2019-02-07
Polishing apparatus, polishing method, and semiconductor manufacturing method Grant 9,902,038 - Fukushima , et al. February 27, 2	2018-02-27
Polishing pad dresser, polishing apparatus and polishing pad dressing method Grant 9,849,558 - Nakayama , et al. December 26, 2	2017-12-26
Semiconductor manufacturing apparatus and manufacturing method of semiconductor device Grant 9,748,090 - Hirasawa , et al. August 29, 2	2017-08-29
Cleaning Apparatus And Cleaning Method App 20170053816 - TAKAGI; Jun ; et al.	2017-02-23
Retainer ring, polish apparatus, and polish method Grant 9,539,696 - Fukushima , et al. January 10, 2	2017-01-10
Polish apparatus, polish method, and method of manufacturing semiconductor device Grant 9,502,318 - Fukushima , et al. November 22, 2	2016-11-22
Polishing Pad Dresser, Polishing Apparatus And Polishing Pad Dressing Method App 20160243672 - NAKAYAMA; Takayuki ; et al.	2016-08-25
Polishing Apparatus, Polishing Method, And Semiconductor Manufacturing Method App 20160233101 - FUKUSHIMA; Dai ; et al.	2016-08-11
Semiconductor Manufacturing Apparatus And Manufacturing Method Of Semiconductor Device App 20160218001 - HIRASAWA; Shinichi ; et al.	2016-07-28
Polishing apparatus and polishing method Grant 9,296,083 - Fukushima , et al. March 29, 2	2016-03-29
Polish Apparatus, Polish Method, And Method Of Manufacturing Semiconductor Device App 20150364389 - FUKUSHIMA; Dai ; et al.	2015-12-17
Retainer Ring, Polish Apparatus, And Polish Method App 20150183082 - FUKUSHIMA; Dai ; et al.	2015-07-02
Polishing Apparatus And Polishing Method App 20140342640 - Fukushima; Dai ; et al.	2014-11-20
Polishing method and method for fabricating semiconductor device Grant 8,778,802 - Fukushima , et al. July 15, 2	2014-07-15
Polishing apparatus and polishing method Grant 8,506,362 - Fukushima , et al. August 13, 2	2013-08-13
CMP slurry for metallic film, polishing method and method of manufacturing semiconductor device Grant 8,337,715 - Minamihaba , et al. December 25, 2	2012-12-25
Manufacturing method of a semiconductor device Grant 8,174,125 - Kurashima , et al. May 8, 2	2012-05-08
Substrate treating method and substrate treating apparatus Grant 8,152,598 - Fukushima , et al. April 10, 2	2012-04-10
Aqueous Dispersion For Chemical Mechanical Polishing, Chemical Mechanical Polishing Method, Kit For Chemical Mechanical Polishing, And Kit For Preparing Aqueous Dispersion For Chemical Mechanical Polishing App 20110250756 - UCHIKURA; Kazuhito ; et al.	2011-10-13
CMP slurry for metallic film, polishing method and method of manufacturing semiconductor device App 20110062374 - Minamihaba; Gaku ; et al.	2011-03-17
CMP slurry for metallic film, polishing method and method of manufacturing semiconductor device Grant 7,842,191 - Minamihaba , et al. November 30, 2	2010-11-30
Aqueous dispersion for CMP, polishing method and method for manufacturing semiconductor device Grant 7,833,431 - Minamihaba , et al. November 16, 2	2010-11-16
Semiconductor Manufacturing Apparatus App 20100203806 - KITAKURA; Tomonori ; et al.	2010-08-12
Semiconductor device fabrication method Grant 7,682,975 - Fukushima , et al. March 23, 2	2010-03-23
Manufacturing Method Of A Semiconductor Device App 20090184415 - Kurashima; Nobuyuki ; et al.	2009-07-23
Aqueous Dispersion For Chemical Mechanical Polishing, Chemical Mechanical Polishing Method, Kit For Chemical Mechanical Polishing, And Kit For Preparing Aqueous Dispersion For Chemical Mechanical Polishing App 20090124172 - Uchikura; Kazuhito ; et al.	2009-05-14
Substrate Treating Method And Substrate Treating Apparatus App 20090124174 - FUKUSHIMA; Dai ; et al.	2009-05-14
Manufacturing method of a semiconductor device Grant 7,521,350 - Kurashima , et al. April 21, 2	2009-04-21
Method for fabricating semiconductor device and polishing method Grant 7,494,931 - Fukushima , et al. February 24, 2	2009-02-24
Method of manufacturing semiconductor device Grant 7,465,668 - Fukushima , et al. December 16, 2	2008-12-16
Substrate Processing Method App 20080254719 - SHIGETA; Atsushi ; et al.	2008-10-16
Slurry for CMP, polishing method and method of manufacturing semiconductor device Grant 7,419,910 - Minamihaba , et al. September 2, 2	2008-09-02
Polishing method for semiconductor wafer and polishing apparatus for semiconductor wafer App 20080113590 - Kubota; Takeo ; et al.	2008-05-15
Slurry for CMP of Cu film, polishing method and method for manufacturing semiconductor device App 20070293049 - Minamihaba; Gaku ; et al.	2007-12-20
Polishing method and method for fabricating semiconductor device App 20070293047 - Fukushima; Dai ; et al.	2007-12-20
Polishing method of Cu film and method for manufacturing semiconductor device Grant 7,307,023 - Fukushima , et al. December 11, 2	2007-12-11
Slurry for touch-up CMP and method of manufacturing semiconductor device App 20070232068 - Minamihaba; Gaku ; et al.	2007-10-04
Aqueous Dispersion For Cmp, Polishing Method And Method For Manufacturing Semiconductor Device App 20070128873 - MINAMIHABA; Gaku ; et al.	2007-06-07
Polishing method of Cu film and method for manufacturing semiconductor device App 20070093064 - Fukushima; Dai ; et al.	2007-04-26
Method for fabricating semiconductor device and polishing method App 20070072427 - Fukushima; Dai ; et al.	2007-03-29
Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion, chemical mechanical polishing process, and process for producing semiconductor devices App 20070049180 - Shida; Hirotaka ; et al.	2007-03-01
Semiconductor device fabrication method App 20060293191 - Fukushima; Dai ; et al.	2006-12-28
Semiconductor device and method of manufacturing the same Grant 7,144,804 - Minamihaba , et al. December 5, 2	2006-12-05
CMP slurry for metallic film, polishing method and method of manufacturing semiconductor device App 20060243702 - Minamihaba; Gaku ; et al.	2006-11-02
Method of manufacturing semiconductor device App 20060175296 - Fukushima; Dai ; et al.	2006-08-10
Manufacturing method of a semiconductor device App 20060151888 - Kurashima; Nobuyuki ; et al.	2006-07-13
Semiconductor device containing a dummy wire Grant 7,042,099 - Kurashima , et al. May 9, 2	2006-05-09
Method of making semiconductor device by polishing with intermediate clean polishing Grant 6,984,582 - Fukushima , et al. January 10, 2	2006-01-10
Method of manufacturing semiconductor device App 20050218008 - Fukushima, Dai ; et al.	2005-10-06
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method Grant 6,935,928 - Uchikura , et al. August 30, 2	2005-08-30
Slurry for CMP, polishing method and method of manufacturing semiconductor device App 20050118821 - Minamihaba, Gaku ; et al.	2005-06-02
Polishing apparatus, polishing method, and semiconductor device fabrication method App 20050118937 - Fukushima, Dai ; et al.	2005-06-02
Semiconductor device and method of manufacturing the same App 20050116348 - Minamihaba, Gaku ; et al.	2005-06-02
Method of manufacturing semiconductor device including two-step polishing operation for cap metal Grant 6,897,143 - Toyoda , et al. May 24, 2	2005-05-24
Semiconductor device having an improved construction in the interlayer insulating film Grant 6,858,936 - Minamihaba , et al. February 22, 2	2005-02-22
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method App 20050037693 - Uchikura, Kazuhito ; et al.	2005-02-17
Semiconductor device manufacturing method App 20040152318 - Fukushima, Dai ; et al.	2004-08-05
Semiconductor device and its manufacturing method App 20040119164 - Kurashima, Nobuyuki ; et al.	2004-06-24
Semiconductor device and method of manufacturing the same App 20040070077 - Minamihaba, Gaku ; et al.	2004-04-15
Method of manufacturing semiconductor device and semiconductor device App 20040005774 - Toyoda, Hiroshi ; et al.	2004-01-08
Polishing apparatus, polishing method and method of manufacturing semiconductor device App 20040002292 - Fukushima, Dai ; et al.	2004-01-01
Slurry for CMP, method of forming thereof and method of manufacturing semiconductor device including a CMP process App 20030165412 - Matsui, Yukiteru ; et al.	2003-09-04
Semiconductor device having a damascene type wiring layer Grant 6,611,060 - Toyoda , et al. August 26, 2	2003-08-26
Chemical mechanical polishing method and semiconductor device manufacturing method App 20020158395 - Mizuno, Naohito ; et al.	2002-10-31
Slurry for CMP, method of forming thereof and method of manufacturing semiconductor device including a CMP process App 20020006728 - Matsui, Yukiteru ; et al.	2002-01-17

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