Fukuoka; Masateru

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fukuoka; Masateru.The latest application filed is for "photoresponsive gas-generating material, micropump and microfluid device".

Company Profile

0.8.18

Fukuoka; Masateru - Osaka JP
Fukuoka; Masateru - Mishima-gun JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Photoresponsive gas-generating material, micropump and microfluid device Grant 8,771,612 - Fukuoka , et al. July 8, 2	2014-07-08
Photoresponsive Gas-generating Material, Micropump And Microfluid Device App 20140134075 - Fukuoka; Masateru ; et al.	2014-05-15
Pressure-sensitive Adhesive Compound, Pressure-sensitive Adhesive Tape, And Wafer Treatment Method App 20130220533 - Tonegawa; Toru ; et al.	2013-08-29
Micropump device Grant 8,353,679 - Yamamoto , et al. January 15, 2	2013-01-15
Micro fluid device Grant 8,197,773 - Fukuoka , et al. June 12, 2	2012-06-12
Micropump Device App 20110129392 - Yamamoto; Kazuki ; et al.	2011-06-02
Micro Fluid Device App 20110044863 - Fukuoka; Masateru ; et al.	2011-02-24
Photoresponsive Gas-generating Material, Micropump And Microfluid Device App 20110014096 - Fukuoka; Masateru ; et al.	2011-01-20
Dicing/die-bonding Tape And Method For Manufacturing Semiconductor Chip App 20100099240 - Watanabe; Kouji ; et al.	2010-04-22
Ic Chip Manufacturing Method App 20080314507 - Hatai; Munehiro ; et al.	2008-12-25
Method for manufacturing semiconductor chip Grant 7,335,578 - Fukuoka , et al. February 26, 2	2008-02-26
Method for manufacturing semiconductor chip App 20070037364 - Sugita; Daihei ; et al.	2007-02-15
Adhesive material, method for peeling adhesive material, and pressure-sensitive adhesive tape App 20060269715 - Hatai; Munehiro ; et al.	2006-11-30
IC chip manufacturing method Grant 6,939,741 - Fukuoka , et al. September 6, 2	2005-09-06
Adhesive material, method for peeling adhesive material, and pressure-sensitive adhesive tape App 20050173051 - Hatai, Munehiro ; et al.	2005-08-11
Adhesive substance, adhesive product, and connected structure App 20050054758 - Hatai, Munehiro ; et al.	2005-03-10
Adhesive material, method for unsticking adhesive material and bound structure App 20040261943 - Fukuoka, Masateru ; et al.	2004-12-30
Method for manufacturing semiconductor chip App 20040259332 - Fukuoka, Masateru ; et al.	2004-12-23
Pressure sensitive adhesive double coated tape and method for producing ic chip using it App 20040248382 - Hatai, Munehiro ; et al.	2004-12-09
Ic chip manufacturing method App 20040185639 - Fukuoka, Masateru ; et al.	2004-09-23
Microparticle arrangement film, electrical connection film, electrical connection structure, and microparticle arrangement method App 20040106334 - Suzuki, Tatsuo ; et al.	2004-06-03
Acrylic copolymer, acrylic pressure-sensitive adhesive composition, acrylic pressure-sensitive adhesive tape or sheet, and acrylic adhesive composition Grant 6,608,143 - Fukuoka , et al. August 19, 2	2003-08-19
Acrylic hot melt pressure-sensitive adhesive and protective film utilizing the same App 20010044024 - Miyashita, Hiraku ; et al.	2001-11-22

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