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name:-0.001633882522583
name:-0.0020630359649658
name:-0.00055789947509766
Fukunga; Hiroya Patent Filings

Fukunga; Hiroya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fukunga; Hiroya.The latest application filed is for "sealant for one drop fill process containing photo-curable resin and heat-curable resin".

Company Profile
0.1.1
  • Fukunga; Hiroya - Tokyo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Sealant for one drop fill process containing photo-curable resin and heat-curable resin
Grant 8,337,965 - Itano , et al. December 25, 2
2012-12-25
Sealant For One Drop Fill Process Containing Photo-curable Resin And Heat-curable Resin
App 20110054061 - Itano; Kazuyuki ;   et al.
2011-03-03

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