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Patent applications and USPTO patent grants for Fukunaga; Satoru.The latest application filed is for "method of thinning semiconductor wafer capable of preventing its front from being contaminated and back grinding device for semiconductor wafers".
Patent | Date |
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Method of thinning semiconductor wafer capable of preventing its front from being contaminated and back grinding device for semiconductor wafers Grant 6,984,586 - Iwasaki , et al. January 10, 2 | 2006-01-10 |
Method of thinning semiconductor wafer capable of preventing its front from being contaminated and back grinding device for semiconductor wafers App 20030082915 - Iwasaki, Noriki ;   et al. | 2003-05-01 |
Jig used for assembling semiconductor devices Grant 6,423,102 - Fukunaga , et al. July 23, 2 | 2002-07-23 |
Method of thinning semiconductor wafer capable of preventing its front from being contaminated and back grinding device for semiconductor wafers App 20020016135 - Iwasaki, Noriki ;   et al. | 2002-02-07 |
Burn-in apparatus and method of use thereof Grant 5,247,248 - Fukunaga September 21, 1 | 1993-09-21 |
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