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name:-0.018311977386475
name:-0.0083041191101074
name:-0.010097026824951
FUKUMITSU; Masakazu Patent Filings

FUKUMITSU; Masakazu

Patent Applications and Registrations

Patent applications and USPTO patent grants for FUKUMITSU; Masakazu.The latest application filed is for "resonance device and method for manufacturing same".

Company Profile
9.6.17
  • FUKUMITSU; Masakazu - Nagaokakyo-shi JP
  • Fukumitsu; Masakazu - Nagaokakyo JP
  • Fukumitsu; Masakazu - Kyoto-fu JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Resonance Device And Method For Manufacturing Same
App 20220231663 - FUKUMITSU; Masakazu ;   et al.
2022-07-21
Package Structure And Method For Manufacturing The Same
App 20220153573 - HIGUCHI; Yoshiyuki ;   et al.
2022-05-19
Resonator and resonance device
Grant 11,329,624 - Goto , et al. May 10, 2
2022-05-10
Resonance Device And Resonance Device Manufacturing Method
App 20210403316 - Fukumitsu; Masakazu ;   et al.
2021-12-30
Resonance Device And Resonance Device Manufacturing Method
App 20210371273 - Fukumitsu; Masakazu ;   et al.
2021-12-02
Mems Device Manufacturing Method And Mems Device
App 20210147224 - Fukumitsu; Masakazu
2021-05-20
Resonance Device And Manufacturing Method Of Resonance Device
App 20210152148 - Dehara; Kentarou ;   et al.
2021-05-20
Device Substrate And Collective Substrate
App 20210118773 - Fukumitsu; Masakazu
2021-04-22
Mems Device
App 20210083647 - Inoue; Yoshihisa ;   et al.
2021-03-18
MEMS device and method for producing same
Grant 10,934,161 - Fukumitsu , et al. March 2, 2
2021-03-02
Mems Device And Method For Manufacturing Mems Device
App 20200391999 - Fukumitsu; Masakazu
2020-12-17
Resonance Device And Method For Producing Resonance Device
App 20200295732 - Fukumitsu; Masakazu ;   et al.
2020-09-17
Wafer level package and wafer level chip size package
Grant 10,497,679 - Fukumitsu , et al. De
2019-12-03
Resonance device and manufacturing method therefor
Grant 10,374,569 - Umeda , et al.
2019-08-06
Resonator And Resonance Device
App 20190109578 - GOTO; Yuichi ;   et al.
2019-04-11
Method for bonding wafers
Grant 10,118,247 - Fukumitsu , et al. November 6, 2
2018-11-06
Resonance Device And Manufacturing Method Therefor
App 20180226937 - Umeda; Keiichi ;   et al.
2018-08-09
Mems Device And Method For Producing Same
App 20180127268 - Fukumitsu; Masakazu ;   et al.
2018-05-10
Wafer Level Package And Wafer Level Chip Size Package
App 20180096972 - Fukumitsu; Masakazu ;   et al.
2018-04-05
Method For Bonding Wafers
App 20170252855 - Fukumitsu; Masakazu ;   et al.
2017-09-07
Mounting substrate and light emitting device
Grant 9,236,357 - Fukumitsu , et al. January 12, 2
2016-01-12
Light-emitting Device
App 20150108533 - FUKUMITSU; Masakazu ;   et al.
2015-04-23
Mounting Substrate And Light Emitting Device
App 20150084090 - FUKUMITSU; Masakazu ;   et al.
2015-03-26

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