loadpatents
Patent applications and USPTO patent grants for FUKUMITSU; Masakazu.The latest application filed is for "resonance device and method for manufacturing same".
Patent | Date |
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Resonance Device And Method For Manufacturing Same App 20220231663 - FUKUMITSU; Masakazu ;   et al. | 2022-07-21 |
Package Structure And Method For Manufacturing The Same App 20220153573 - HIGUCHI; Yoshiyuki ;   et al. | 2022-05-19 |
Resonator and resonance device Grant 11,329,624 - Goto , et al. May 10, 2 | 2022-05-10 |
Resonance Device And Resonance Device Manufacturing Method App 20210403316 - Fukumitsu; Masakazu ;   et al. | 2021-12-30 |
Resonance Device And Resonance Device Manufacturing Method App 20210371273 - Fukumitsu; Masakazu ;   et al. | 2021-12-02 |
Mems Device Manufacturing Method And Mems Device App 20210147224 - Fukumitsu; Masakazu | 2021-05-20 |
Resonance Device And Manufacturing Method Of Resonance Device App 20210152148 - Dehara; Kentarou ;   et al. | 2021-05-20 |
Device Substrate And Collective Substrate App 20210118773 - Fukumitsu; Masakazu | 2021-04-22 |
Mems Device App 20210083647 - Inoue; Yoshihisa ;   et al. | 2021-03-18 |
MEMS device and method for producing same Grant 10,934,161 - Fukumitsu , et al. March 2, 2 | 2021-03-02 |
Mems Device And Method For Manufacturing Mems Device App 20200391999 - Fukumitsu; Masakazu | 2020-12-17 |
Resonance Device And Method For Producing Resonance Device App 20200295732 - Fukumitsu; Masakazu ;   et al. | 2020-09-17 |
Wafer level package and wafer level chip size package Grant 10,497,679 - Fukumitsu , et al. De | 2019-12-03 |
Resonance device and manufacturing method therefor Grant 10,374,569 - Umeda , et al. | 2019-08-06 |
Resonator And Resonance Device App 20190109578 - GOTO; Yuichi ;   et al. | 2019-04-11 |
Method for bonding wafers Grant 10,118,247 - Fukumitsu , et al. November 6, 2 | 2018-11-06 |
Resonance Device And Manufacturing Method Therefor App 20180226937 - Umeda; Keiichi ;   et al. | 2018-08-09 |
Mems Device And Method For Producing Same App 20180127268 - Fukumitsu; Masakazu ;   et al. | 2018-05-10 |
Wafer Level Package And Wafer Level Chip Size Package App 20180096972 - Fukumitsu; Masakazu ;   et al. | 2018-04-05 |
Method For Bonding Wafers App 20170252855 - Fukumitsu; Masakazu ;   et al. | 2017-09-07 |
Mounting substrate and light emitting device Grant 9,236,357 - Fukumitsu , et al. January 12, 2 | 2016-01-12 |
Light-emitting Device App 20150108533 - FUKUMITSU; Masakazu ;   et al. | 2015-04-23 |
Mounting Substrate And Light Emitting Device App 20150084090 - FUKUMITSU; Masakazu ;   et al. | 2015-03-26 |
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