Fukumitsu; Kenshi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Fukumitsu; Kenshi.The latest application filed is for "substrate dividing method".
Company Profile
6.103.87
- Fukumitsu; Kenshi - Hamamatsu JP
- FUKUMITSU; Kenshi - Hamamatsu-shi JP
- Fukumitsu; Kenshi - Shizuoka JP
Patent Activity
| Patent | Date |
|---|---|
| Substrate dividing method Grant 11,424,162 - Fujii , et al. August 23, 2 | 2022-08-23 |
| Laser processing method and device Grant 11,241,757 - Atsumi , et al. February 8, 2 | 2022-02-08 |
| Substrate Dividing Method App 20210210387 - FUJII; Yoshimaro ; et al. | 2021-07-08 |
| Laser processing method and laser processing apparatus Grant 10,796,959 - Fukuyo , et al. October 6, 2 | 2020-10-06 |
| Substrate Dividing Method App 20200203225 - FUJII; Yoshimaro ; et al. | 2020-06-25 |
| Substrate dividing method Grant 10,622,255 - Fujii , et al. | 2020-04-14 |
| Laser machining device and laser machining method Grant 10,556,293 - Fukumitsu Feb | 2020-02-11 |
| Optical plate, light irradiation device, light measurement device, light irradiation method, and light measurement method Grant 10,495,804 - Yamamoto , et al. De | 2019-12-03 |
| Wavelength conversion-type spatial light modulation device Grant 10,429,720 - Saito , et al. O | 2019-10-01 |
| Laser Processing Method And Device App 20190232422 - ATSUMI; Kazuhiro ; et al. | 2019-08-01 |
| Laser processing method and device Grant 10,293,433 - Atsumi , et al. | 2019-05-21 |
| Optical Plate, Light Irradiation Device, Light Measurement Device, Light Irradiation Method, And Light Measurement Method App 20190121013 - YAMAMOTO; Satoshi ; et al. | 2019-04-25 |
| Optical plate, light irradiation device, light measurement device, light irradiation method, and light measurement method Grant 10,180,525 - Yamamoto , et al. Ja | 2019-01-15 |
| Substrate Dividing Method App 20180350682 - FUJII; Yoshimaro ; et al. | 2018-12-06 |
| Substrate dividing method Grant 10,068,801 - Fujii , et al. September 4, 2 | 2018-09-04 |
| Light source device Grant 10,032,622 - Asai , et al. July 24, 2 | 2018-07-24 |
| Laser Processing Method And Laser Processing Apparatus App 20180068897 - FUKUYO; Fumitsugu ; et al. | 2018-03-08 |
| Light Source Device App 20180012750 - ASAI; Akinori ; et al. | 2018-01-11 |
| Laser processing method and laser processing apparatus Grant 9,837,315 - Fukuyo , et al. December 5, 2 | 2017-12-05 |
| Light source device Grant 9,824,879 - Asai , et al. November 21, 2 | 2017-11-21 |
| Substrate Dividing Method App 20170271210 - FUJII; Yoshimaro ; et al. | 2017-09-21 |
| Light Source Device App 20170250066 - ASAI; Akinori ; et al. | 2017-08-31 |
| Substrate dividing method Grant 9,711,405 - Fujii , et al. July 18, 2 | 2017-07-18 |
| Optical Plate, Light Irradiation Device, Light Measurement Device, Light Irradiation Method, And Light Measurement Method App 20170146720 - YAMAMOTO; Satoshi ; et al. | 2017-05-25 |
| Light source device Grant 9,646,816 - Asai , et al. May 9, 2 | 2017-05-09 |
| Laser Machining Device And Laser Machining Method App 20170113298 - FUKUMITSU; Kenshi | 2017-04-27 |
| Substrate dividing method Grant 9,553,023 - Fujii , et al. January 24, 2 | 2017-01-24 |
| Substrate dividing method Grant 9,548,246 - Fujii , et al. January 17, 2 | 2017-01-17 |
| Substrate dividing method Grant 9,543,256 - Fujii , et al. January 10, 2 | 2017-01-10 |
| Substrate dividing method Grant 9,543,207 - Fujii , et al. January 10, 2 | 2017-01-10 |
| Laser Processing Method And Device App 20160368085 - ATSUMI; Kazuhiro ; et al. | 2016-12-22 |
| Laser processing method and device Grant 9,511,449 - Atsumi , et al. December 6, 2 | 2016-12-06 |
| Substrate Dividing Method App 20160343618 - FUJII; Yoshimaro ; et al. | 2016-11-24 |
| Substrate Dividing Method App 20160343674 - FUJII; Yoshimaro ; et al. | 2016-11-24 |
| Substrate Dividing Method App 20160343617 - FUJII; Yoshimaro ; et al. | 2016-11-24 |
| Substrate Dividing Method App 20160343619 - FUJII; Yoshimaro ; et al. | 2016-11-24 |
| Light Source Device App 20160233079 - ASAI; Akinori ; et al. | 2016-08-11 |
| Substrate Dividing Method App 20160111333 - FUJII; Yoshimaro ; et al. | 2016-04-21 |
| Substrate dividing method Grant 9,287,177 - Fujii , et al. March 15, 2 | 2016-03-15 |
| Substrate Dividing Method App 20150311119 - FUJII; Yoshimaro ; et al. | 2015-10-29 |
| Substrate dividing method Grant 9,142,458 - Fujii , et al. September 22, 2 | 2015-09-22 |
| Wavelength Conversion-type Spatial Light Modulation Device App 20150219980 - Saito; Hiroshi ; et al. | 2015-08-06 |
| Laser Processing Method And Laser Processing Apparatus App 20150111365 - FUKUYO; Fumitsugu ; et al. | 2015-04-23 |
| Method of cutting a wafer-like object and semiconductor chip Grant 8,969,761 - Fukuyo , et al. March 3, 2 | 2015-03-03 |
| Laser processing method Grant 8,969,752 - Fukumitsu , et al. March 3, 2 | 2015-03-03 |
| Substrate Dividing Method App 20150056785 - FUJII; Yoshimaro ; et al. | 2015-02-26 |
| Laser processing method and laser processing apparatus Grant 8,946,592 - Fukuyo , et al. February 3, 2 | 2015-02-03 |
| Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device Grant 8,946,589 - Fukuyo , et al. February 3, 2 | 2015-02-03 |
| Method of manufacturing a semiconductor device formed using a substrate cutting method Grant 8,946,591 - Fukuyo , et al. February 3, 2 | 2015-02-03 |
| Laser processing method for cutting substrate and laminate part bonded to the substrate Grant 8,946,055 - Sakamoto , et al. February 3, 2 | 2015-02-03 |
| Laser processing method and laser processing apparatus Grant 8,937,264 - Fukuyo , et al. January 20, 2 | 2015-01-20 |
| Method of cutting a substrate and method of manufacturing a semiconductor device Grant 8,933,369 - Fukuyo , et al. January 13, 2 | 2015-01-13 |
| Three-dimensional position-sensitive radiation detector and method of identifying radiation detected positions therein Grant 8,933,410 - Inadama , et al. January 13, 2 | 2015-01-13 |
| Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device Grant 8,927,900 - Fukuyo , et al. January 6, 2 | 2015-01-06 |
| Laser processing method and laser processing system Grant 8,890,027 - Fukuyo , et al. November 18, 2 | 2014-11-18 |
| Substrate dividing method Grant 8,889,525 - Fujii , et al. November 18, 2 | 2014-11-18 |
| Laser beam working machine Grant 8,872,067 - Fukumitsu , et al. October 28, 2 | 2014-10-28 |
| Method of cutting semiconductor substrate Grant 8,865,566 - Fukuyo , et al. October 21, 2 | 2014-10-21 |
| Laser beam machining method, laser beam machining apparatus, and laser beam machining product Grant 8,852,698 - Fukumitsu October 7, 2 | 2014-10-07 |
| Laser beam working machine Grant 8,841,580 - Fukumitsu , et al. September 23, 2 | 2014-09-23 |
| Laser processing method Grant 8,802,543 - Fukuyo , et al. August 12, 2 | 2014-08-12 |
| Laser processing method and laser processing apparatus Grant 8,716,110 - Fukuyo , et al. May 6, 2 | 2014-05-06 |
| Laser Processing Method And Device App 20140097163 - ATSUMI; Kazuhiro ; et al. | 2014-04-10 |
| Laser beam machining method Grant 8,685,838 - Fukuyo , et al. April 1, 2 | 2014-04-01 |
| Laser Processing Method App 20140080288 - FUKUYO; Fumitsugu ; et al. | 2014-03-20 |
| Method of cutting object to be processed Grant 8,673,745 - Fukuyo , et al. March 18, 2 | 2014-03-18 |
| Laser processing method and device Grant 8,624,153 - Atsumi , et al. January 7, 2 | 2014-01-07 |
| Method Of Cutting Object To Be Processed App 20130344686 - Fukuyo; Fumitsugu ; et al. | 2013-12-26 |
| Laser processing method Grant 8,598,015 - Fukuyo , et al. December 3, 2 | 2013-12-03 |
| Substrate Dividing Method App 20130316517 - FUJII; Yoshimaro ; et al. | 2013-11-28 |
| Semiconductor substrate cutting method Grant 8,551,817 - Fukumitsu , et al. October 8, 2 | 2013-10-08 |
| Method of cutting an object to be processed Grant 8,551,865 - Fukuyo , et al. October 8, 2 | 2013-10-08 |
| Method Of Cutting Semiconductor Substrate App 20130252403 - Fukuyo; Fumitsugu ; et al. | 2013-09-26 |
| Laser Processing Method App 20130252402 - FUKUYO; Fumitsugu ; et al. | 2013-09-26 |
| Substrate dividing method Grant 8,518,801 - Fujii , et al. August 27, 2 | 2013-08-27 |
| Substrate dividing method Grant 8,519,511 - Fujii , et al. August 27, 2 | 2013-08-27 |
| Substrate dividing method Grant 8,518,800 - Fujii , et al. August 27, 2 | 2013-08-27 |
| Method of cutting semiconductor substrate Grant 8,450,187 - Fukuyo , et al. May 28, 2 | 2013-05-28 |
| Method of cutting semiconductor substrate via modified region formation and subsequent sheet expansion Grant 8,409,968 - Fukuyo , et al. April 2, 2 | 2013-04-02 |
| Three-dimensional radiation position detector and method of identifying sensed positions therein App 20130056638 - Inadama; Naoko ; et al. | 2013-03-07 |
| Laser processing method Grant 8,361,883 - Fukuyo , et al. January 29, 2 | 2013-01-29 |
| Substrate Dividing Method App 20130015167 - Fujii; Yoshimaro ; et al. | 2013-01-17 |
| Laser Processing Method And Laser Processing Apparatus App 20130017670 - Fukuyo; Fumitsugu ; et al. | 2013-01-17 |
| Substrate Dividing Method App 20130012000 - FUJII; Yoshimaro ; et al. | 2013-01-10 |
| Substrate Dividing Method App 20130009284 - FUJII; Yoshimaro ; et al. | 2013-01-10 |
| Method Of Cutting Semiconductor Substrate App 20120329248 - FUKUYO; Fumitsugu ; et al. | 2012-12-27 |
| Semiconductor chip manufacturing method Grant 8,314,013 - Fujii , et al. November 20, 2 | 2012-11-20 |
| Laser Processing Method And Laser Processing Apparatus App 20120279947 - FUKUYO; Fumitsugu ; et al. | 2012-11-08 |
| Substrate dividing method Grant 8,304,325 - Fujii , et al. November 6, 2 | 2012-11-06 |
| Laser processing method and laser processing apparatus Grant 8,283,595 - Fukuyo , et al. October 9, 2 | 2012-10-09 |
| Method for dicing substrate Grant 8,268,704 - Fujii , et al. September 18, 2 | 2012-09-18 |
| Method Of Manufacturing A Semiconductor Device Formed Using A Substrate Cutting Method App 20120228276 - Fukuyo; Fumitsugu ; et al. | 2012-09-13 |
| Method for cutting semiconductor substrate Grant 8,263,479 - Fukuyo , et al. September 11, 2 | 2012-09-11 |
| Laser beam machining method Grant 8,247,734 - Fukuyo , et al. August 21, 2 | 2012-08-21 |
| Method Of Cutting An Object To Be Processed App 20120205358 - FUKUYO; Fumitsugu ; et al. | 2012-08-16 |
| Laser Processing Method And Laser Processing Apparatus App 20120205357 - Fukuyo; Fumitsugu ; et al. | 2012-08-16 |
| Laser Processing Method And Laser Processing Apparatus App 20120190175 - FUKUYO; Fumitsugu ; et al. | 2012-07-26 |
| Laser processing method and laser processing apparatus Grant 8,227,724 - Fukuyo , et al. July 24, 2 | 2012-07-24 |
| Method of cutting an object to be processed Grant 8,183,131 - Fukuyo , et al. May 22, 2 | 2012-05-22 |
| Semiconductor Substrate Cutting Method App 20120077315 - FUKUMITSU; Kenshi ; et al. | 2012-03-29 |
| Laser Machining Device And Laser Machining Method App 20120061356 - Fukumitsu; Kenshi | 2012-03-15 |
| Manufacturing method of semiconductor laser element Grant 8,110,422 - Kumagai , et al. February 7, 2 | 2012-02-07 |
| Laser Beam Working Machine App 20120006797 - Fukumitsu; Kenshi ; et al. | 2012-01-12 |
| Method Of Cutting Semiconductor Substrate App 20110306182 - Fukuyo; Fumitsugu ; et al. | 2011-12-15 |
| Semiconductor substrate cutting method Grant 8,058,103 - Fukumitsu , et al. November 15, 2 | 2011-11-15 |
| Laser Beam Working Machine App 20110274128 - Fukumitsu; Kenshi ; et al. | 2011-11-10 |
| Optical Element, Laser Beam Oscillation Device And Laser Beam Amplifying Device App 20110222289 - Yamamoto; Koei ; et al. | 2011-09-15 |
| Laser processing method and semiconductor chip Grant 7,947,574 - Sakamoto , et al. May 24, 2 | 2011-05-24 |
| Method Of Cutting A Wafer-like Object And Semiconductor Chip App 20110037149 - FUKUYO; FUMITSUGU ; et al. | 2011-02-17 |
| Method Of Cutting A Substrate, Method Of Processing A Wafer-like Object, And Method Of Manufacturing A Semiconductor Device App 20110027971 - FUKUYO; Fumitsugu ; et al. | 2011-02-03 |
| Method Of Cutting A Substrate And Method Of Manufacturing A Semiconductor Device App 20110027972 - FUKUYO; Fumitsugu ; et al. | 2011-02-03 |
| Method Of Cutting A Substrate, Method Of Cutting A Wafer-like Object, And Method Of Manufacturing A Semiconductor Device App 20110021004 - FUKUYO; Fumitsugu ; et al. | 2011-01-27 |
| Laser beam machining method, laser beam machining apparatus, and laser beam machining product App 20100327416 - Fukumitsu; Kenshi | 2010-12-30 |
| Laser processing method and laser processing apparatus Grant 7,825,350 - Fukuyo , et al. November 2, 2 | 2010-11-02 |
| Manufacturing Method Of Semiconductor Laser Element App 20100240159 - Kumagai; Masayoshi ; et al. | 2010-09-23 |
| Semiconductor Substrate Cutting Method App 20100203678 - FUKUMITSU; Kenshi ; et al. | 2010-08-12 |
| Substrate Dividing Method App 20100203707 - Fujii; Yoshimaro ; et al. | 2010-08-12 |
| Laser Processing Method And Laser Processing Apparatus App 20100176100 - Fukuyo; Fumitsugu ; et al. | 2010-07-15 |
| Laser Processing Method And Semiconductor Chip App 20100178751 - SAKAMOTO; Takeshi ; et al. | 2010-07-15 |
| Method of cutting processed object Grant 7,749,867 - Fukuyo , et al. July 6, 2 | 2010-07-06 |
| Laser beam machining method, laser beam machining apparatus, and laser beam machining product App 20100151202 - Fukumitsu; Kenshi | 2010-06-17 |
| Laser processing method and laser processing apparatus Grant 7,732,730 - Fukuyo , et al. June 8, 2 | 2010-06-08 |
| Laser processing method and semiconductor chip Grant 7,718,510 - Sakamoto , et al. May 18, 2 | 2010-05-18 |
| Laser processing method and laser processing apparatus App 20100055876 - Fukuyo; Fumitsugu ; et al. | 2010-03-04 |
| Method Of Cutting An Object To Be Processed App 20100015783 - FUKUYO; Fumitsugu ; et al. | 2010-01-21 |
| Laser cutting by forming a modified region within an object and generating fractures Grant 7,626,137 - Fukuyo , et al. December 1, 2 | 2009-12-01 |
| Laser processing method and laser processing apparatus Grant 7,615,721 - Fukuyo , et al. November 10, 2 | 2009-11-10 |
| Laser beam machining method, laser beam machining apparatus, and laser beam machining product Grant 7,605,344 - Fukumitsu October 20, 2 | 2009-10-20 |
| Laser Processing Method And Laser Processing System App 20090236324 - Fukuyo; Fumitsugu ; et al. | 2009-09-24 |
| Laser processing method and laser processing apparatus Grant 7,592,238 - Fukuyo , et al. September 22, 2 | 2009-09-22 |
| Substrate dividing method Grant 7,566,635 - Fujii , et al. July 28, 2 | 2009-07-28 |
| Laser Processing Method And Semiconductor Chip App 20090166808 - Sakamoto; Takeshi ; et al. | 2009-07-02 |
| Laser processing method and laser processing apparatus Grant 7,547,613 - Fukuyo , et al. June 16, 2 | 2009-06-16 |
| Laser processing device Grant 7,489,454 - Fukuyo , et al. February 10, 2 | 2009-02-10 |
| Laser Processing Method And Device App 20080218735 - Atsumi; Kazuhiro ; et al. | 2008-09-11 |
| Laser processing method for cutting a wafer-like object by using a laser to form modified regions within the object Grant 7,396,742 - Fukuyo , et al. July 8, 2 | 2008-07-08 |
| Substrate dividing method App 20080090382 - Fujii; Yoshimaro ; et al. | 2008-04-17 |
| Laser Processing Method And Semiconductor Chip App 20070290299 - Sakamoto; Takeshi ; et al. | 2007-12-20 |
| Laser beam machining method, laser beam machining apparatus, and laser beam machining product App 20070170159 - Fukumitsu; Kenshi | 2007-07-26 |
| Laser processing method App 20070158314 - Fukumitsu; Kenshi ; et al. | 2007-07-12 |
| Laser beam machining method App 20070125757 - Fukuyo; Fumitsugu ; et al. | 2007-06-07 |
| Semiconductor substrate cutting method App 20070085099 - Fukumitsu; Kenshi ; et al. | 2007-04-19 |
| Laser beam machining method App 20060255024 - Fukuyo; Fumitsufu ; et al. | 2006-11-16 |
| Laser processing method and laser processing apparatus App 20060160331 - Fukuyo; Fumitsugu ; et al. | 2006-07-20 |
| Laser processing device App 20060151443 - Fukuyo; Fumitsugu ; et al. | 2006-07-13 |
| Method for cutting semiconductor substrate App 20060148212 - Fukuyo; Fumitsugu ; et al. | 2006-07-06 |
| Device and method for laser processing App 20060144828 - Fukumitsu; Kenshi ; et al. | 2006-07-06 |
| Substrate dividing method App 20060121697 - Fujii; Yoshimaro ; et al. | 2006-06-08 |
| Laser processing method and laser processing apparatus App 20060040473 - Fukuyo; Fumitsugu ; et al. | 2006-02-23 |
| Laser processing method and laser processing apparatus Grant 6,992,026 - Fukuyo , et al. January 31, 2 | 2006-01-31 |
| Method of cutting processed object App 20060011593 - Fukuyo; Fumitsugu ; et al. | 2006-01-19 |
| Method for dicing substrate App 20050272223 - Fujii, Yoshimaro ; et al. | 2005-12-08 |
| Laser processing method App 20050202596 - Fukuyo, Fumitsugu ; et al. | 2005-09-15 |
| Laser processing method and laser processing apparatus App 20050194364 - Fukuyo, Fumitsugu ; et al. | 2005-09-08 |
| Laser processing method and laser processing apparatus App 20050189330 - Fukuyo, Fumitsugu ; et al. | 2005-09-01 |
| Laser processing method and laser processing apparatus App 20050184037 - Fukuyo, Fumitsugu ; et al. | 2005-08-25 |
| Laser processing method and laser processing apparatus App 20050181581 - Fukuyo, Fumitsugu ; et al. | 2005-08-18 |
| Laser processing method and laser processing apparatus App 20050173387 - Fukuyo, Fumitsugu ; et al. | 2005-08-11 |
| Laser processing method and laser processing apparatus App 20040002199 - Fukuyo, Fumitsugu ; et al. | 2004-01-01 |
| Optically pumped solid laser Grant 5,121,404 - Aoshima , et al. June 9, 1 | 1992-06-09 |
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