FUKUI; YASUKI

Patent Applications and Registrations

Patent applications and USPTO patent grants for FUKUI; YASUKI.The latest application filed is for "test socket and method of manufacturing the same".

Company Profile

1.10.12

FUKUI; YASUKI - Sakai City JP
Fukui; Yasuki - Osaka-shi JP
Fukui; Yasuki - Osaka N/A JP
Fukui; Yasuki - Sakai-shi JP
Fukui; Yasuki - Sakai JP
Fukui; Yasuki - Tenri JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Test Socket And Method Of Manufacturing The Same App 20210063442 - TAMAKI; KAZUO ; et al.	2021-03-04
Semiconductor Device And Method For Producing Same App 20150200176 - Mori; Katsunori ; et al.	2015-07-16
Semiconductor device and connector Grant 8,608,388 - Fukui , et al. December 17, 2	2013-12-17
Semiconductor Device And Connector App 20100272402 - Fukui; Yasuki ; et al.	2010-10-28
Adhesive Sheet for Dicing and Die Bonding App 20090220783 - FUKUI; Yasuki ; et al.	2009-09-03
Semiconductor Device, Method For Manufacturing The Same, Heat Sink, Semiconductor Chip, Interposer Substrate, And Glass Plate App 20080237898 - YANO; Yuji ; et al.	2008-10-02
Adhesive Sheet For Both Dicing And Die Bonding And Semiconductor Device Manufacturing Method Using The Adhesive Sheet App 20080241995 - Fukui; Yasuki ; et al.	2008-10-02
Semiconductor device App 20070262466 - Fukui; Yasuki	2007-11-15
Semiconductor device and manufacturing method of same Grant 7,119,426 - Fukui , et al. October 10, 2	2006-10-10
Semiconductor device and method of stacking semiconductor chips App 20060197211 - Miyata; Koji ; et al.	2006-09-07
Semiconductor device and manufacturing method of same App 20050253229 - Fukui, Yasuki ; et al.	2005-11-17
Semiconductor device and method of manufacturing the same Grant RE38,806 - Fukui , et al. October 4, 2	2005-10-04
Wiring substrate, semiconductor device and package stack semiconductor device Grant 6,731,013 - Juso , et al. May 4, 2	2004-05-04
Semiconductor device having insulation layer and adhesion layer between chip lamination Grant 6,657,290 - Fukui , et al. December 2, 2	2003-12-02
Semiconductor device and method of stacking semiconductor chips App 20020180025 - Miyata, Koji ; et al.	2002-12-05
Semiconductor device App 20020096755 - Fukui, Yasuki ; et al.	2002-07-25
Semiconductor device and method of manufacturing the same Grant 6,352,879 - Fukui , et al. March 5, 2	2002-03-05
Wiring substrate, semiconductor device and package stack semiconductor device App 20020000327 - Juso, Hiroyuki ; et al.	2002-01-03
Semiconductor device and method of manufacturing the same Grant 6,229,217 - Fukui , et al. May 8, 2	2001-05-08
Semiconductor device Grant 6,198,165 - Yamaji , et al. March 6, 2	2001-03-06
Semiconductor device and method of manufacturing the same Grant 6,100,594 - Fukui , et al. August 8, 2	2000-08-08

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.