loadpatents
Patent applications and USPTO patent grants for Fukui; Yasuharu.The latest application filed is for "polyamide composition and molded article produced from the composition".
Patent | Date |
---|---|
Polyamide resin composition Grant 10,533,089 - Miyamoto , et al. Ja | 2020-01-14 |
Polyamide composition and molded article produced from the composition Grant 10,465,060 - Miyamoto , et al. No | 2019-11-05 |
Polyamide Composition And Molded Article Produced From The Composition App 20170306126 - MIYAMOTO; Akio ;   et al. | 2017-10-26 |
Polyamide Resin Composition App 20130072622 - Miyamoto; Akio ;   et al. | 2013-03-21 |
Hydrogen tank liner material and hydrogen tank liner Grant 8,053,523 - Fukui , et al. November 8, 2 | 2011-11-08 |
Material For Sliding Component App 20100227972 - Katayama; Tsutomu ;   et al. | 2010-09-09 |
Material for laser welding and laser welding method Grant 7,718,271 - Katayama , et al. May 18, 2 | 2010-05-18 |
Thermoplastic resin composition and moldings thereof Grant 7,589,142 - Maeda , et al. September 15, 2 | 2009-09-15 |
Hydrogen Tank Liner Material And Hydrogen Tank Liner App 20090203845 - Fukui; Yasuharu ;   et al. | 2009-08-13 |
Material for Laser Welding App 20090159034 - Katayama; Tsutomu ;   et al. | 2009-06-25 |
Method for laser welding App 20080257489 - Katayama; Tsutomu ;   et al. | 2008-10-23 |
Circuit-formed substrate and method of manufacturing circuit-formed substrate Grant 7,356,916 - Nishii , et al. April 15, 2 | 2008-04-15 |
Material for laser welding and laser welding method App 20070134504 - Katayama; Tsutomu ;   et al. | 2007-06-14 |
Kit of materials for laser welding and method for laser welding App 20060185791 - Katayama; Tsutomu ;   et al. | 2006-08-24 |
Thermoplastic resin composition and moldings thereof App 20060004141 - Maeda; Kazuhiko ;   et al. | 2006-01-05 |
Circuit-formed subtrate and method of manufacturing circuit-formed substrate App 20040058136 - Nishii, Toshihiro ;   et al. | 2004-03-25 |
Laser Welding material and laser welding method App 20040045663 - Katayama, Tsutomu ;   et al. | 2004-03-11 |
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