Fukui; Akihiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fukui; Akihiro.The latest application filed is for "underfill material, laminated sheet and method for producing semiconductor device".

Company Profile

0.5.13

Fukui; Akihiro - Ibaraki JP
Fukui; Akihiro - Ibaraki-shi JP
Fukui; Akihiro - Osaka JP
Fukui; Akihiro - Kobe JP
Fukui; Akihiro - Kobe-shi JP
Fukui; Akihiro - Saitama JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Dicing-tape integrated film for backside of semiconductor and method of manufacturing semiconductor device Grant 10,141,217 - Takamoto , et al. Nov	2018-11-27
Underfill material, laminated sheet and method for producing semiconductor device Grant 10,014,235 - Takamoto , et al. July 3, 2	2018-07-03
Dicing-tape integrated film for backside of semiconductor and method of manufacturing semiconductor device Grant 9,679,797 - Takamoto , et al. June 13, 2	2017-06-13
Underfill Material, Laminated Sheet and Method for Producing Semiconductor Device App 20170018472 - Takamoto; Naohide ; et al.	2017-01-19
Method for Manufacturing Semiconductor Device, Sheet-Shaped Resin Composition, and Dicing Tape-Integrated Sheet-Shaped Resin Composition App 20160240523 - Takamoto; Naohide ; et al.	2016-08-18
Semiconductor Device Manufacturing Method App 20160240394 - Fukui; Akihiro ; et al.	2016-08-18
Semiconductor Device Manufacturing Method App 20160233184 - Hanazono; Hiroyuki ; et al.	2016-08-11
Thermosetting Resin Composition And Method For Producing A Semiconductor Device App 20160075871 - Morita; Kosuke ; et al.	2016-03-17
Adhesive Film For Underfill, Adhesive Film For Underfill Integrated With Tape For Grinding Rear Surface, Adhesive Film For Underfill Integrated With Dicing Tape, And Semiconductor Device App 20160040045 - Morita; Kosuke ; et al.	2016-02-11
Underfill Film, Sealing Sheet, Method Of Manufacturing Semiconductor Device, And Semiconductor Device App 20160035640 - MORITA; Kosuke ; et al.	2016-02-04
Semiconductor Device Production Method, Sheet-shaped Resin Composition, Dicing Tape-integrated Sheet-shaped Resin Composition App 20160013089 - Takamoto; Naohide ; et al.	2016-01-14
Underfill Sheet, Underfill Sheet Integrated With Tape For Grinding Rear Surface, Underfill Sheet Integrated With Dicing Tape, And Method For Manufacturing Semiconductor Device App 20150380277 - Morita; Kosuke ; et al.	2015-12-31
Dicing-tape Integrated Film For Backside Of Semiconductor And Method Of Manufacturing Semiconductor Device App 20150364357 - TAKAMOTO; Naohide ; et al.	2015-12-17
Dicing-tape Integrated Film For Backside Of Semiconductor And Method Of Manufacturing Semiconductor Device App 20150357223 - TAKAMOTO; Naohide ; et al.	2015-12-10
Engine controller Grant 7,415,343 - Zushi , et al. August 19, 2	2008-08-19
Engine Controller App 20080077303 - Zushi; Yuji ; et al.	2008-03-27
3-Hydroxypropyl ester of 2-trifluoromethylacrylic acid and process for producing same Grant 7,199,262 - Tada , et al. April 3, 2	2007-04-03
3-Hydroxypropyl ester of 2-trifluoromethylacrylic acid and process for producing same App 20060009653 - Tada; Takahisa ; et al.	2006-01-12

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