Fukuda, Kimio
Patent Applications and Registrations
Patent applications and USPTO patent grants for Fukuda, Kimio.The latest application filed is for "asymmetric multi-layer film having polyamide layer".
- Fukuda, Kimio - Yamaguchi JP
- Fukuda; Kimio - Ebina JP
- Fukuda; Kimio - Hirakata JP
| Patent | Date |
|---|---|
| Asymmetric multi-layer film having polyamide layer App 20050058789 - Nonaka, Hirofumi ; et al. | 2005-03-17 |
| Supressing in rush current from a power supply during live wire insertion and removal of a circuit board Grant 5,764,926 - Fukuda , et al. June 9, 1 | 1998-06-09 |
| Dental adhesive comprising an itaconic acid monoester compound Grant 5,234,972 - Saitoh , et al. August 10, 1 | 1993-08-10 |
| Polyamide adhesive composition for laminates containing aminosilane and grafted polyolefin Grant 4,780,358 - Ito , et al. October 25, 1 | 1988-10-25 |
| Metal polyamide adhesive laminates Grant 4,690,856 - Ito , et al. September 1, 1 | 1987-09-01 |
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